Hostname: page-component-586b7cd67f-dsjbd Total loading time: 0 Render date: 2024-11-25T17:36:16.982Z Has data issue: false hasContentIssue false
  • English
  • Français

Growth, Structure, and Thin Film Stress in TiAl AND Ti3Al FILMS

Published online by Cambridge University Press:  15 February 2011

M. Chinmulgund ,
R. B. Inturi  and
J. A. Barnard
M. Chinmulgund
Affiliation:
Department of metallurgical and Materials Engineering, The University of Alabama, Tuscaloosa, Al 35487–0202
R. B. Inturi
Affiliation:
Department of metallurgical and Materials Engineering, The University of Alabama, Tuscaloosa, Al 35487–0202
J. A. Barnard
Affiliation:
Department of metallurgical and Materials Engineering, The University of Alabama, Tuscaloosa, Al 35487–0202
Get access

Abstract

Thin films of Ti, Al, TiAl and Ti3Al were deposited by dc magnetron sputtering onto 2” dia. oxidized Si<111> wafers and their mechanical properties were studied by measuring the internal stress in the films. Ti and Ti3Al films show hexagonal structure with preferred orientation in the (0002) direction. TiAl is tetragonal, nanocrystalline, and (111) oriented; Al is random fee polycrystalline in nature. Young's Modulii of thin films of these materials were calculated from the stress temperature plots. The E values of TiAI and Ti3Al thin films were found to be significantly higher than those of the bulk Materials.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 317: Symposium B – Mechanisms of Thin Film Evolution , 1993 , 503
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Nourbakhsh, S. and Margolin, H. in Metals and Ceramic Matrix Composites: Processing. Modeling & Mechanical Behavior, edited by Bhagat, R. B., Clauer, A. H., Kumar, P. and Ritter, A. M. (The Mineral, Metals and Materials Society, 1990).Google Scholar
[2] Kim, Y. W. in Microstructure/Property Relationships in Titanium Aluminides and Ti Alloys, edited by Kim, Y. W. and Boyer, R. R. (The Mineral, Metals and Materials Society, 1991).Google Scholar
[3] Lahav, A., Grim, K. A., and Blech, I. A., J. Appl. Phys. 67, 734 (1990)Google Scholar
[4] Retajczk, T. F. Jr. and Sinha, A. K., App. Phys. Lett. 36, 161 (1980)Google Scholar
[5] Blech, I. A. and Wood, P., J. Vac. Sci. Technol. A 11, 728 (1993).Google Scholar
[6] Inturi, R. B., Barnard, J. A., Chinmulgund, M. and Jarratt, J. D., MRS Symp. Proc. Spring 1993. (in press).Google Scholar
[7] Hoffman, R. W., Anders, F. J., and Crittenden, E. C. Jr, J. Appl. Phys., 24, 231 (1953)Google Scholar
[8] Seitz, F., Advances in Physics 1, 43 (1952)Google Scholar
[9] Thornton, J. A. and Hoffman, D. W., J. Vac. Sci Technol. 14, 164 (1977)Google Scholar
[10] Buckel, W., J. Vac. Sci. Technol. 6, 606 (1969)Google Scholar
[11] Kinosita, K., Thin Solid Films 12, 17 (1972)Google Scholar