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Growth and Field Emission Properties of Boron Nitride Island Films by Low-energy Ion-assisted Deposition

Published online by Cambridge University Press:  07 March 2011

K. Teii
Affiliation:
Department of Applied Science for Electronics and Materials, Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, Kasuga, Fukuoka 816-8580, Japan
J. H. C. Yang
Affiliation:
Department of Applied Science for Electronics and Materials, Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, Kasuga, Fukuoka 816-8580, Japan
R. Yamao
Affiliation:
Department of Applied Science for Electronics and Materials, Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, Kasuga, Fukuoka 816-8580, Japan
S. Matsumoto
Affiliation:
National Institute for Materials Science, 1-2-1 Sengen, Tsukuba, Ibaraki 305-004, Japan and Ceramic Forum Co. Ltd., 1-6-6 Taitoh, Taitoh-ku, Tokyo 110-0016, Japan.
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Abstract

We report the growth and field emission properties of boron nitride (BN) island films by chemical vapor deposition in inductively coupled plasma. Fine-grained island films with large surface roughness can be grown for initial sp2-bonded BN and subsequent cubic BN (cBN) phases by using low-energy (~20 eV) ion bombardment. Ultraviolet photoelectron spectroscopy indicates that the electron affinity is as low as 0.3 eV for both sp2-bonded BN and cBN phases. The evolution of cBN islands reduces the turn-on field down to around 9 V/μm and increases the current density up to 10-4 A/cm2. The surface potential barrier height is estimated to be about 3.4 eV for emission from the Fermi level.

Type
Research Article
Copyright
Copyright © Materials Research Society 2011

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References

REFERENCES

1. Himpsel, F. J., Knapp, J. A., van Vechten, J. A., and Eastman, D. E., Phys. Rev. B 20, 624 (1979).Google Scholar
2. Benjamin, M. C., Wang, C., Davis, R. F., and Nemanich, R. J., Appl. Phys. Lett. 64, 3288 (1994).Google Scholar
3. Powers, M. J., Benjamin, M. C., Porter, L. M., Nemanich, R. J., Davis, R. F., Cuomo, J. J., Doll, G. L., and Harris, S. J., Appl. Phys. Lett. 67, 3912 (1995).Google Scholar
4. Loh, K. P., Sakaguchi, I., Gamo, M. N., Tagawa, S., Sugino, T., and Ando, T., Appl. Phys. Lett. 74, 28 (1999).Google Scholar
5. Wang, R. Z., Wang, B., Wang, H., Zhou, H., Huang, A. P., Zhu, M. K., Yan, H., and Yan, X. H., Appl. Phys. Lett. 81, 2782 (2002).Google Scholar
6. Schlesser, R., McClure, M. T., McCarson, B. L., and Sitar, Z., J. Appl. Phys. 82, 5763 (1997).Google Scholar
7. Jayatissa, A. H., Sato, F., Saito, N., Sawada, K., Masuda, T., and Nakanishi, Y., J. Vac. Sci. Technol. B 17, 237 (1999).Google Scholar
8. Wang, R. Z., Zhou, H., Song, X. M., Wang, B., Wang, H., and Yan, H., J. Cryst. Growth 291, 18 (2006).Google Scholar
9. Moseler, M., Gumbsch, P., Casiraghi, C., Ferrari, A. C., and Robertson, J., Science 309, 1545 (2005).Google Scholar
10. Teii, K., Yamao, R., Yamamura, T., and Matsumoto, S., J. Appl. Phys. 101, 033301 (2007).Google Scholar
11. Matsumoto, S. and Zhang, W. J., Diamond Relat. Mater. 10, 1868 (2001).Google Scholar
12. Teii, K., Matsumoto, S., and Robertson, J., Appl. Phys. Lett. 92, 013115 (2008).Google Scholar
13. Teii, K., Yamao, R., and Matsumoto, S., J. Appl. Phys. 106, 113706 (2009).Google Scholar
14. Teii, K., Hori, T., and Matsumoto, S., Thin Solid Films 519, 1817 (2011).Google Scholar
15. Nose, K., Yang, H. S., and Yoshida, T., Diamond Relat. Mater. 14, 1297 (2005).Google Scholar
16. Sugino, T., Kawasaki, S., Tanioka, K., and Shirafuji, J., Appl. Phys. Lett. 71, 18 (1997).Google Scholar
17. He, B., Zhang, W. J., Zou, Y. S., Chong, Y. M., Ye, Q., Ji, A. L., Yang, Y., Bello, I., and Lee, S. T., Appl. Phys. Lett. 92, 102108 (2008).Google Scholar