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Gravimetric Measurements of Moisture Uptake in Polyimide Films Used in Integrated Circuit Packaging

Published online by Cambridge University Press:  21 February 2011

Denice D. Denton  and
Hartono Pranjoto
Denice D. Denton
Affiliation:
Department of Electrical and Computer Engineringand Materials Science ProgramUniversity of Wisconsin-Madison, 1415 Johnson Dr., Madison, WI 53706
Hartono Pranjoto
Affiliation:
Department of Electrical and Computer Engineringand Materials Science ProgramUniversity of Wisconsin-Madison, 1415 Johnson Dr., Madison, WI 53706
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Abstract

Polyimide is used extensively in a variety of integrated circuit packaging applications. It is a good dielectric material with excellent planarizing capabilities, but like most polymers, it absorbs moisture. This hygroscopic behavior can lead to reliability problems in integrated circuit packages. The effects of variations in process history on moisture uptake are examined using gravimetric measurement techniques. In particular, the effects of cure schedule and exposure to high temperature/high humidity environments on steady state moisture uptake are reported. Steady state moisture uptake is shown to be a decreasing function of cure temperature. Moreover, the steady state moisture uptake in polyimide is greater after the samples have been “aged” in a high temperature and humidity ambient. Electrical measurements are used to examine the effects of cure temperature on diffusion kinetics of moisture in polyimide. The diffusion coefficient decreases with increasing cure temperature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989 , 97
Copyright
Copyright © Materials Research Society 1989

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