Hostname: page-component-6bf8c574d5-h6jzd Total loading time: 0.001 Render date: 2025-02-20T14:57:30.238Z Has data issue: false hasContentIssue false
  • English
  • Français

Grain Size Effects on the Adhesion of Thin Ductile Films

Published online by Cambridge University Press:  10 February 2011

M.J. Cordill ,
T. Muppidi  and
D.F. Bahr
M.J. Cordill
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, WA
T. Muppidi
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, WA
Get access

Abstract

Grain size can be controlled by varying the process conditions used to deposit the film and post growth processing. This study examines how the grain size will impact the mechanical properties, hardness and adhesion, of thin ductile films on brittle substrates. The grain structures of copper and tin films were examined using OIM and AFM. The interfacial fracture toughness of each film was calculated using a tungsten overlayer and mechanics based models. The hardnesses of the films were correlated to the measured interfacial fracture toughness, and demonstrate that increased hardness correlates to an increased sensitivity to the Mode II component of loading.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 778: Symposium U – Mechanical Properties Derived from Nanostructuring Materials , 2003 , U7.4
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Volinsky, A.A., Moody, N.R., Gerberich, W.W. Mater. Res. Soc. Symp. Proc. 594, 383 (2002).Google Scholar
[2] Moody, N.R., Adams, D.P., Cordill, M.J., Yang, N., Bahr, D.F. (2002) Mater. Res. Soc. Symp. Proc. 695, L7.5 (2002).Google Scholar
[3] Dieter, G.E., Mechanical Metallurgy, Boston, McGraw Hill (1986) 3rd edition.Google Scholar
[4] Tabor, D., Proc. R. Soc. A 192, 247 (1948).Google Scholar
[5] Oliver, W.C., Pharr, G.M., J. Mater. Res. 7, 1564 (1992).Google Scholar
[6] Thornton, J.A., Ann. Rev. Mater. Sci., 7, 239 (1977).Google Scholar
[7] Evans, A.G., Hutchinson, J.W., Inter. J. Solid Structures 20, 455 (1984).Google Scholar
[8] Hutchinson, J.W., Suo, Z., Advances in Applied Mechanics, Academic Press, New York, 1992, 64–191.Google Scholar
[9] Thouless, M. D., Acta Met. Mater. 38, 1135 (1990).Google Scholar
[10] Moon, M.-W., Jensen, H.M., Hutchinson, J.W., Oh, K.H., Evans, A.G., J. Mech. Phys. Solids 50, 2355 (2002).Google Scholar
[11] Cordill, M.J., Moody, N.R., Bahr, D.F., Mat. Res, Soc. Symp. Proc. 750, Y1.8 (2003).Google Scholar