Hostname: page-component-cd9895bd7-fscjk Total loading time: 0 Render date: 2024-12-23T17:50:01.187Z Has data issue: false hasContentIssue false

Grain Refinement and Mechanical Properties Enhancement in Cross Roll Rolled Pure Copper

Published online by Cambridge University Press:  31 January 2012

Kuk Hyun Song
Affiliation:
Korea Institute of Industrial Technology, 7-47, Songdo-Dong, Yeonsu-gu, Incheon, 406-840, Korea. Email: [email protected]
Han Sol Kim
Affiliation:
Korea Institute of Industrial Technology, 7-47, Songdo-Dong, Yeonsu-gu, Incheon, 406-840, Korea. Email: [email protected]
Won Yong Kim
Affiliation:
Korea Institute of Industrial Technology, 7-47, Songdo-Dong, Yeonsu-gu, Incheon, 406-840, Korea. Email: [email protected]
Get access

Abstract

To evaluate the microstructures and mechanical properties in cross-roll rolled pure copper, comparing with conventionally rolled materials, this work was carried out. Pure copper (99.99 mass%) sheets with thickness of 5 mm were cold rolled to 90% thickness reduction by cross-roll rolling (CRR) and subsequently annealed at 400 °C for 30 min. Also, to analyze the grain boundary character distributions (GBCDs), electron back-scattered diffraction (EBSD) technique was employed. As a result, the cold rolled and annealed materials consisted of significantly refined grains than that of the initial material (100 μm). Especially, the CRR processed material showed more refined grain size (6.5 μm) in average than that (9.8 μm) of conventional rolling (CR). These grain refinements directly affected an increase in mechanical properties. Furthermore, the texture development in CRR processed material, in which <112> grains were densely distributed in the normal direction (ND), was more effective to enhance the yield strength.

Type
Articles
Copyright
Copyright © Materials Research Society 2012

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Chino, Y., Sassa, K., Kamiya, A. and Mabuchi, M., Mater. Sci. Eng. A 441, 349 (2006).Google Scholar
2. Sitarama Raju, K., Ghanashyam Krishna, M., Padmanabhan, K. A., Muraleedharan, K., Gurao, N. P. and Wilde, G., Mater. Sci. Eng. A 491, 1 (2008).Google Scholar
3. Schafler, E. and Pippan, R., Mater. Sci. Eng. A 387, 799 (2004).Google Scholar
4. Kim, W. J., Lee, K. E. and Choi, S. H., Mater. Sci. Eng. A 506, 71 (2009).Google Scholar
5. Valiev, R. Z., Islamgaliev, R. K. and Alexandrov, I. V., Progr. Mater. Sci. 45, 103 (2000).Google Scholar
6. McFadden, S. X., Mishra, R. S., Valiev, R. Z., Zhilyaev, A. P. and Mukherjee, A. K., Nature 398, 684 (1998).Google Scholar
7. Chino, Y., Sassa, K., Kamiya, A. and Mabuchi, M., Mater. Sci. Eng. A 473, 195 (2007).Google Scholar
8. Nah, J. J., Kang, H. G., Huh, M. Y. and Engler, O., Scripta Mater. 58, 500 (2008).Google Scholar
9. Kim, S. H., Kang, H. G., Huh, M. Y. and Engler, O., Mater. Sci. Eng. A 508, 121 (2009).Google Scholar
10. Chino, Y., Sassa, K., Kamiya, A. and Mabuchi, M., Mater. Sci. Eng. A 473, 195 (2007).Google Scholar