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Grain Impingement and Intrinsic Stresses in CVD Diamond

Published online by Cambridge University Press:  10 February 2011

S. Nijhawan ,
J. Rankin ,
B. L Walden  and
B. W. Sheldon
S. Nijhawan
Affiliation:
Division of Engineering, Brown University, Providence RI02912
J. Rankin
Affiliation:
Division of Engineering, Brown University, Providence RI02912
B. L Walden
Affiliation:
B.L.Walden, Trinity College, Hartford, CT 06106
B. W. Sheldon
Affiliation:
Division of Engineering, Brown University, Providence RI02912
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Abstract

Intrinsic stresses in polycrystalline CVD diamond films have been related to restructuring at grain boundaries. It is speculated that reducing the interfacial energy induces an elastic tensile strain. There appears to be a correlation between the evolution of macroscopic stresses in the entire sample and localized, non-homogeneous stresses in the microstructure based on Raman Spectroscopy and x-ray diffraction pole figures. A multistep processing sequence developed previously can help reduce these stresses substantially, by using an intermediate annealing step when the diamond grains are partially coalesced. Our results suggest that small changes in the film microstructure due to annealing can reduce both homogeneous and non-homogeneous stresses.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 505 , 1997 , 415
Copyright
Copyright © Materials Research Society 1998

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References

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