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Grain Growth in Nanocrystalline Nickel

Published online by Cambridge University Press:  15 February 2011

G.D. Hibbard ,
U. Erb ,
K.T. Aust  and
G. Palumbo
G.D. Hibbard
Affiliation:
Metallurgy and Materials Science, University of Toronto, Toronto, ON, Canada, M5S 3E4
U. Erb
Affiliation:
Metallurgy and Materials Science, University of Toronto, Toronto, ON, Canada, M5S 3E4
K.T. Aust
Affiliation:
Metallurgy and Materials Science, University of Toronto, Toronto, ON, Canada, M5S 3E4
G. Palumbo
Affiliation:
Integran Technologies Inc., 1 Meridian Road, Toronto, ON, Canada, M9W 4Z6
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Abstract

In this study, the effect of grain size distribution on the thermal stability of electrodeposited nanocrystalline nickel was investigated by pre-annealing material such that a limited amount of abnormal grain growth was introduced. This work was done in an effort to understand the previously reported, unexpected effect, of increasing thermal stability with decreasing grain size seen in some nanocrystalline systems. Pre-annealing produced a range of grain size distributions in materials with relatively unchanged crystallographic texture and total solute content. Subsequent thermal analysis of the pre-annealed samples by differential scanning calorimetry showed that the activation energy of further grain growth was unchanged from the as-deposited nanocrystalline nickel.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 580: Symposium E – Nucleation & Growth Processes in Materials , 1999 , 183
Copyright
Copyright © Materials Research Society 2000

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References

1. Gleiter, H., Prog. Mat. Sci. 33, 223 (1989).Google Scholar
2. Stuwe, H.P., Recrystallization of Metallic Materials, edited by Haessner, F. (Dr.Riederer Verlag GmbH, Stuttgart, 1978) p. 12.Google Scholar
3. Chen, L.C. and Spaepen, F., J. Appl. Phys. 69, 679 (1991).Google Scholar
4. Turi, T., PhD thesis, Queen's University, Kingston, Ontario, Canada, (1997).Google Scholar
5. Hibbard, G. D., Palumbo, G., Aust, K.T. and Erb, U., University of Toronto, submitted to Scripta Mat., (1999).Google Scholar
6. Lu, K., Luck, R., and Predel, B., Scripta Met. et Mat. 28, 1387 (1993).Google Scholar
7. Lu, K., and Sun, N.X., Phil. Mag. Lett. 75, 389 (1997).Google Scholar
8. Erb, U., Palumbo, G., Szpunar, B., and Aust, K.T., NanoStr. Mat. 9, 261 (1997).Google Scholar
9. Erb, U., El-Sherik, A.M., U.S. Patent No. 5 353 266 (1994).Google Scholar
10. Gill, P.S., Sauerbrunn, S.R., and Reading, M., J. Thermal Anal. 40, 931 (1993).Google Scholar
11. Cullity, B.D., Elements of X-Ray Diffraction, 2nd ed. (Addison-Wesley Publishing Company, Don Mills, 1978) p. 102.Google Scholar
12. Reading, M., Elliott, D., and Hill, V.L., J. Thermal Anal. 40, 949 (1993).Google Scholar
13. Wang, N., Wang, Z., Aust, K.T., and Erb, U., Acta Mater. 45, 1655 (1997).Google Scholar
14. Cheung, C., Djuanda, F., Erb, U., and Palumbo, G., NanoStr. Mat. 5, 513 (1995).Google Scholar
15. Mehta, S.C., Smith, D.A., Erb, U., Mater. Sci. Eng. A 204, 227 (1995).Google Scholar
16. Klement, U., Erb, U., El-Sherik, A.M., and Aust, K.T., Mater. Sci. Eng. A 203, 177 (1995).Google Scholar