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Grain Boundary Diffusion in NiFe/Ag Bilayer Thin Films

Published online by Cambridge University Press:  15 February 2011

M. Gall
Affiliation:
Materials Laboratory for Interconnect and Packaging, University of Texas at Austin, BRC/MER Mail Code 78650, Austin, TX 78712-1100
J.G. Pellerin
Affiliation:
Materials Laboratory for Interconnect and Packaging, University of Texas at Austin, BRC/MER Mail Code 78650, Austin, TX 78712-1100
P.S. Ho
Affiliation:
Materials Laboratory for Interconnect and Packaging, University of Texas at Austin, BRC/MER Mail Code 78650, Austin, TX 78712-1100
K.R. Coffey
Affiliation:
IBM Storage Systems Division, 5600 Cottle Rd, 808/282, San Jose, CA 95193
J.K. Howard
Affiliation:
IBM Storage Systems Division, 5600 Cottle Rd, 808/282, San Jose, CA 95193
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Abstract

X-ray photoelectron spectroscopy (XPS) has been used to investigate grain boundary diffusion of Ag through 250 Å thick Ni80Fe20 (permalloy) films in the temperature range of 375 to 475°C. Grain boundary diffusivities were determined by modeling the accumulation of Ag on Ni80Fe20 surfaces as a function of time at fixed annealing temperature. The grain boundary diffusivity of Ag through Ni80Fe20 is characterized by a diffusion coefficient prefactor, D0,gb, of 0.9 cm2/sec and an activation energy, Ea,gb, of 2.2 eV. The Ni80Fe20 film microstructure has been investigated before and after annealing by atomic force microscopy and x-ray diffraction. The microstructure of Ni80Fe20 deposited on Ag underlayers remained relatively unchanged upon annealing.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

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References

REFERENCES

1. Hylton, T.L., Coffey, K.R., Parker, M.A. and Howard, J.K., Science 261, 1021 (1993).CrossRefGoogle Scholar
2. Hwang, J.C.M. and Balluffi, R.W., J. Appl. Phys. 50, 1339 (1979).CrossRefGoogle Scholar
3. Holl-Pellerin, J.G., Anderson, S.G.H., Ho, P.S., Coffey, K.R., Howard, J.K., and Barmak, K., Mat. Res. Soc. Symp. Proc. Vol. 313, 205 (1993).CrossRefGoogle Scholar
4. Proctor, A. and Sherwood, P.M.A., Anal. Chem. 54, 13 (1982).CrossRefGoogle Scholar
5. Harrison, L.G., Trans. Faraday Soc. 57, 1191 (1961).CrossRefGoogle Scholar
6. Gupta, D., Campbell, D.R., and Ho, P.S. in Thin Films - Interdiffusions and Reactions, edited by Poate, J.M., Tu, K.N., and Mayer, J.W. (Wiley, New York, 1978), p. 161.Google Scholar
7. Kaur, I. and Gust, W., Fundamentals of Grain and Interphase Boundary Diffusion (Ziegler Press, Stuttgart, 1989).Google Scholar
8. Scofield, J.H., J. Electron. Spectrosc. 8, 129 (1976).CrossRefGoogle Scholar
9. Seah, M.P. and Dench, W.A., Surf. Interface Anal. 1, 2 (1979).CrossRefGoogle Scholar
10. Wagner, C.D. in Practical Surface Analysis (Second Edition), Vol 1: Auger and X-ray Photoelectron Spectroscopy, edited by Briggs, D. and Seah, M.P. (John Wiley & Sons, Ltd, 1990), p. 607.Google Scholar
11. Samorjai, G.A., Chemistry in Two Dimensions: Surfaces (Cornell University Press, Ithaca, NY, 1981).Google Scholar
12. Hwang, J. C.-M., PhD Thesis, Cornell University, 1978 Google Scholar
13. Landolt-Börnstein Numerical Data and Functional Relationships in Science and Technology, edited by Madelung, O. and Mehrer, H. (Springer-Verlag, Berlin, 1990), Group III, Vol. 26, p. 129.Google Scholar
14. Fisher, J.C., J. Appl. Phys. 22, 74 (1951).CrossRefGoogle Scholar