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Grain Boundary Characteristics and Stress-induced Damage Morphologies in Sputtered and Electroplated Copper Films

Published online by Cambridge University Press:  01 February 2011

Hyun Park ,
Soo-Jung Hwang ,
Kyu Hwan Oh  and
Young-Chang Joo
Hyun Park
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151-742, Korea
Soo-Jung Hwang
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151-742, Korea
Kyu Hwan Oh
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151-742, Korea
Young-Chang Joo
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151-742, Korea
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Abstract

Various Cu films were fabricated using sputtering and electroplating with and without additive, and their surface damages after annealing were investigated. After annealing at 435°C, the difference between damage morphologies of the films was observed. In some films stressinduced grooves along the grain boundaries were observed, while in the others voids at the grain boundary triple junctions were observed. It was also observed that the stress-induced groove was formed along the high energy grain boundaries. To explain the morphological difference of surface damages, a simple parameter considering the contributions of grain structures and grain boundary characteristics to surface and grain boundary diffusions is suggested. The effective grain boundary area, which is a function of grain size, film thickness and the fraction of high energy grain boundaries, played a key role in the morphological difference.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 766: Symposium E – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics - 2003 , 2003 , E2.3
Copyright
Copyright © Materials Research Society 2003

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