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Glass Films and Interfaces in Microelectronic Applications

Published online by Cambridge University Press:  25 February 2011

R. C. Buchanan  and
C. V. Beck
R. C. Buchanan
Affiliation:
Department of Ceramic Engineering, University of Illinois at Urbana- Champaign, Urbana, IL 61801
C. V. Beck
Affiliation:
Advanced Micro Devices, Box 3543, Sunnyvale, CA 94088
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Abstract

Use of dielectric films is integral to most microelectronic packaging, as passive components for device insulation (interlayer dielectric, passivation, diffusion layer), as thin layer capacitive structures or as insulating coatings for thin film and thick film hybrid circuits. Depending on deposition technique, film composition may include SiO2, Al2O3, Si3N4, modified silicate or phosphate glasses as insulators. Compositions as well as methodologies for film preparation on Si, glass or metal substrate by spin coating (or spraying) are discussed, including film/substrate interface characteristics and properties related to dielectric film coatings.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 41
Copyright
Copyright © Materials Research Society 1986

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