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Germanium Concentration Profiles Across Interfaces And Close To Dislocations In Cvd Si1−xGex-on-Si Junctions.

Published online by Cambridge University Press:  25 February 2011

J. Bruley
Affiliation:
Max-Planck-lnstitut für Metallforschung, 7000 Stuttgart 1, Germany.
F. Ernst
Affiliation:
Max-Planck-lnstitut für Metallforschung, 7000 Stuttgart 1, Germany.
K. Ljutovich
Affiliation:
institute of Electronics, Academy of Sciences, Academgorodok, 700125, USSR
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Abstract

This work concerns a microanalytical study of CVD heteroepitaxial Si1–xGex/Si junctions with x ranging from 0.05 to 0.22. We observe that rather than being chemically abrupt, the width of the interface ranges between 200nm and 2μm with a band of misfit dislocations occupying the same region. Furthermore, the average separation of the dislocations is 2 or 3 times greater than predicted by b/δ considerations. Close scrutiny at individual dislocations within the interface region reveals a local deficit of several hundred Ge atoms per nanometer of dislocation line. It is proposed that the composition profile is rapidly spread by inter-diffusion along dislocations during the deposition process.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

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References

REFERENCES

[1] Arienzo., M., Iyer, S.S., Meyerson, B.S., Patton, G.L. and Stork, , J.M.C.Appl. Surf. Sci. 48: 377, (1991).CrossRefGoogle Scholar
[2] Hull, R. and Bean, , J.C.J. Vac. Sci. Technol. A. 7(4): 2580, (1989).CrossRefGoogle Scholar
[3] Eaglesham, DJ., Kvam, E.P., Maher, D.C., Humphreys, C.J. and Bean, , J.C. Phil. Mag. A. 59(5): 1059, (1989).Google Scholar
[4].Kvam, E.P., Maher, D.M. and Humphreys, , C.P. J. Mater. Res. 5 (9): 1900, (1990).CrossRefGoogle Scholar
[5] LeGoues, F.K., Meyerson, B.S. and Morar, , J.F. Phys. Rev. Letts. 66: 2903, (1991).Google Scholar
[6] Gibbings, C.J., Tuppen, C.G. and Hockley, , M. Appl. Phys. Lett. 54(2): 148, (1989).CrossRefGoogle Scholar
[7] Liou, H.K., Mei, P., Gennser, U. and Yang, , E.S. Appl. Phys. Lett. 59 : 1200, (1991).CrossRefGoogle Scholar
[8] Hofer, , F. Microsc. Microanaly. Microstruct. 2(2/3): 215, (1991).Google Scholar
[9] Panteleev, V.A., Baryshev, R.S., Lainer, L.V., Zinina, A.G. and Pakhutina, , E.F. Sov. Phys. Sol. State. 16: 320, (1974).Google Scholar
[10] Stark, J.P.Solid State Diffusion.” (1976) John Wiley & Sons. New York. Google Scholar
[11].Cottrell, A.H. and Bilby, , B.A.Proc. Phys. Soc. A. 62: 49, (1949).CrossRefGoogle Scholar
[12] Dorner, P., Gust, W., Lodding, A., Odelius, H., Predel, B. and Roll, U., “Diffusion in Metals and Alloys”, Diffusion and Defect Monograph Ser. 7, ed. Kedves, and Beke, , Trans. Tech. Publications, 488 (1983)Google Scholar
[13] Eugène, J., LeGoues, F.K., Kesan, V.P., Iyer, S.S. and d'Heurle, , F.M.Appl. Phys. Lett. 59(1): 78, (1991).Google Scholar