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Generation and Suppression of Stacking Faults in Gap Layers Grown on Si(100) Substrates by Molecular Beam Epitaxy and Migration Enhanced Epitaxy

Published online by Cambridge University Press:  10 February 2011

Y. Takagi
Affiliation:
Department of Electrical and Electronic Engineering Toyohashi University of Technology 1-1 Tempaku-cho, Toyohashi, Aichi 441, Japan
H. Yonezu
Affiliation:
Department of Electrical and Electronic Engineering Toyohashi University of Technology 1-1 Tempaku-cho, Toyohashi, Aichi 441, Japan
K. Samonji
Affiliation:
Department of Electrical and Electronic Engineering Toyohashi University of Technology 1-1 Tempaku-cho, Toyohashi, Aichi 441, Japan
T. Tsuji
Affiliation:
Department of Electrical and Electronic Engineering Toyohashi University of Technology 1-1 Tempaku-cho, Toyohashi, Aichi 441, Japan
N. Ohshima
Affiliation:
Department of Electrical and Electronic Engineering Toyohashi University of Technology 1-1 Tempaku-cho, Toyohashi, Aichi 441, Japan
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Abstract

We have investigated the generation process of crystalline defects in GaP layers grown on Si substrates (GaP/Si) by molecular beam epitaxy (MBE) and migration enhanced epitaxy (MEE). Transmission electron microscopy observations revealed that a regular network of misfit dislocations was generated in GaP/Si by MEE. On the other hand, threading dislocations as well as interfacial misfit dislocations were observed in GaP/Si by MBE. Moreover, stacking faults were generated in high density at the hetero-interface of GaP/Si by MBE. The density of stacking faults was drastically reduced by MEE.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

1. Hayashi, I., Jpn. J. Appl. Phys. 32, 266 (1993).Google Scholar
2. Takagi, Y., Yonezu, H, Kawai, T., Hayashida, K., Samonji, K., Ohshima, N. and Pak, K., J. Cryst. Growth 150, 677 (1995).Google Scholar
3. Samonji, K., Yonezu, H., Takagi, Y., Iwaki, K., Ohshima, N., Shin, J. K. and Pak, K., Appl. Phys. Lett. 69, 100 (1996).Google Scholar
4. Ishizaka, A. and Shiraki, Y., J. Electrochem. Soc. 133, 666 (1986).Google Scholar
5. Chang, K. H., Gibala, R., Srolovitz, D., Bhattacharya, P. K. and Mansfield, J.F., J. Appl. Phys. 67, 4093 (1990).Google Scholar
6. Kawai, T., Yonezu, H., Saito, D., Yokozeki, M. and Pak, K., Jpn. J. Appl. Phys. 33, L1740 (1994).Google Scholar
7. Bozso, F. and Avouris, Ph., Phys. Rev. B 43, 1847 (1991).Google Scholar
8. Kuo, L. H., Salamance-Riba, L., Wu, B. J., Haugen, G. M., DePuydt, J. M., Hofler, G. and Cheng, H., J. Vac. Sci. Technol. B 13, 1694 (1995).Google Scholar