Hostname: page-component-669899f699-chc8l Total loading time: 0 Render date: 2025-04-27T23:27:49.106Z Has data issue: false hasContentIssue false
  • English
  • Français

Fracture Behavior of Epoxy-Based, Hybrid Particulate Composites

Published online by Cambridge University Press:  10 February 2011

M. F. DiBerardino  and
R. A. Pearson
M. F. DiBerardino
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Bethlehem, PA 18015.
R. A. Pearson
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Bethlehem, PA 18015.
Get access

Abstract

Epoxy-based, particulate composites are commonly used in packaging applications for the microelectronics industry. For example molding compounds, die attach adhesives, and encapsulant resins are all polymer matrix, particulate-reinforced composites. The mechanical behavior of these materials is a function of the type of resin, the shape and size of the reinforcing particles, the filler content, etc. In this paper, we will examine the interactions of the toughening mechanisms between rubber particles and the reinforcing particles. Hybrid-particulate composites are prepared by compounding both rubber particles and disc-shaped boron nitride particles in a bisphenol A-based epoxy cured with piperidine. Interestingly, there are combinations of rubber and reinforcing particles that lead to synergistic toughening. The underlying causes for synergistic toughening will be discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998 , 239
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

1. Kinloch, A. J., Maxwell, D., and Young, R. J., J. Mater. Sci. 20, 4169 (1985).Google Scholar
2. Roulin-Moloney, A. C., Cantwell, W. J., and Kausch, H. H., Polym. Comp. 8, 314 (1987).Google Scholar
3. Low, I. M, Bandyopakhyay, S., and Mai, Y. W., Polym. Int. 27, 131 (1992).Google Scholar
4. Azimi, H. R., Pearson, R. A., and Hertzberg, R. W., J. Appl. Polym. Sci. 58, 449 (1995).Google Scholar
5. Azimi, H. R., Pearson, R. A., and Hertzberg, R. W., Polym. Eng. & Sci. 36, 2352 (1996).Google Scholar