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Flexible Printed Supercapacitors Based on Nanostructured Materials

Published online by Cambridge University Press:  06 September 2013

Saeed Maleksaeedi
Affiliation:
Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore 638075.
Bee Yen Tay
Affiliation:
Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore 638075.
Pooi See Lee
Affiliation:
School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, Nanyang Avenue, Singapore 639798.
Foo Khuen Lai
Affiliation:
Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore 638075.
Chee Wai Lu
Affiliation:
Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore 638075.
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Abstract

With the advent of printed electronics and flexible devices, flexible energy storage has received so much attention in the past few years. In this work, a scalable process for manufacturing of a flexible supercapacitor device based on nanostructured PANI and MnO2 was demonstrated. In this process, nanostructured materials are transformed into form of a printable ink which is applied on a current collector using a simple screen printing method, which can be used in a roll to roll scheme. The flexible device was assembled using a solid polymer electrolyte and the electrochemical performance of the devices was evaluated. A specific capacitance of 120 F/g and 89 F/g for two symmetrical devices based on PANI and MnO2 were obtained respectively. The devices are showing relatively good cyclability and columbic efficiency.

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Articles
Copyright
Copyright © Materials Research Society 2013 

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References

REFERENCES

Kaempgen, M., Chan, C. K., Ma, J., Cui, Y., and Gruner, G., Nano Lett. 9, 1872 (2009).CrossRefGoogle Scholar
Kiebele, A., Kaempgen, M., and Gruner, G., Nanotech. Law Bus. 5 [1], 7 (2008).Google Scholar
Hu, L. B., Wu, H., and Cui, Y., Appl. Phys. Lett. 96 [18], 183502 (2010).CrossRefGoogle Scholar
Preisler, S. and Lange, G., Nanotech. Law Bus. 5 [1], 17 (2008).Google Scholar
Leenen, M. A. M., Arning, V., Thiem, H., Steiger, J., and Anselmann, R., Phys. Status Solidi A 206, 588 (2009).CrossRefGoogle Scholar
Wong, W. S. and Salleo, A., Flexible Electronics: Materials and Applications. Springer Science, USA, 2009.CrossRefGoogle Scholar
Gardiner, F. and Carter, E., Polymer Electronics; A Flexible Technology. iSmithers, UK, 2009.Google Scholar
Hiong Yap, G., Cheng Hwee, C., Soon Mei, C., and Boon Keng, L., “Performance characterization of flexible printed supercapacitors,” pp. 301-4 in 2009 11th Electronics Packaging Technology Conference (EPTC 2009), 9–11 Dec. 2009. 2009 11th Electronics Packaging Technology Conference (EPTC 2009) .Google Scholar
Pech, D., Brunet, M., Taberna, P. L., Simon, P., Fabre, N., Mesnilgrente, F., Conedera, V., and Durou, H., J. Power Sources 195 [4], 1266 (2010).CrossRefGoogle Scholar
Pouget, J. P., Jozefowicz, M. E., Epstein, A. J., Tang, X., and Macdiarmid, A. G., Macromolecules 24 [3], 779 (1991).CrossRefGoogle Scholar
Li, F., Shi, J. J., and Qin, X., Chin. Sci. Bull. 55 [11], 1100 (2010).CrossRefGoogle Scholar
Villegas, J. C., Giraldo, O. H., Laubernds, K., and Suib, S. L., Inorg. Chem. 42 [18], 5621 (2003).CrossRefGoogle Scholar