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Fatigue Testing of microsized samples of γ-TiAl based material

Published online by Cambridge University Press:  26 February 2011

Timothy P. Halford ,
Kazuki Takashima  and
Yakichi Higo
Timothy P. Halford
Affiliation:
Precision & Intelligence Laboratory, Tokyo Institute of Technology, 4259 Nagatsuta, Midori-ku, Yokohama 226–8503, Japan.
Kazuki Takashima
Affiliation:
Precision & Intelligence Laboratory, Tokyo Institute of Technology, 4259 Nagatsuta, Midori-ku, Yokohama 226–8503, Japan.
Yakichi Higo
Affiliation:
Precision & Intelligence Laboratory, Tokyo Institute of Technology, 4259 Nagatsuta, Midori-ku, Yokohama 226–8503, Japan.
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Abstract

High strength γ-TiAl based alloys, such as Ti-46Al-5Nb-1W (Alloy 7), which were originally developed for gas turbine and automotive applications are now being considered for application in Micro Electro Mechanical Systems (MEMS). This requires the evaluation of these materials upon the microscale. As international standards do not currently exist for the evaluation of the mechanical properties of samples with dimensions equivalent to those required by MEMS devices, the development of new methods was required. The method developed here is intended for the fatigue testing of samples measuring ≈ 10μm (B) × 20μm (W) × 40μm (L). This is completed using a machine recently developed at Tokyo Institute of Technology to load samples of lamellar γ-TiAl based material to failure in compressive bending. This method is intended to work alongside methods previously developed for the fracture toughness testing of similar microsized cantilever bend specimens.

In this work sample cantilevers of Alloy 7 are Focussed Ion Beam (FIB) machined from foil ≈ 20μm thick and their stress - life (S-N) fatigue behaviour evaluated. The dependence of fatigue life upon lamellar orientation for a given peak stress / stress range is considered. The effect of the reduced scale of these samples upon the mean and scatter of these sample lifetimes is also considered through comparison with previous data obtained from the S-N testing of macrosized samples of the same material.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 842: Symposium S – Integrative and Interdisciplinary Aspects of Intermetallics , 2004 , S6.9
Copyright
Copyright © Materials Research Society 2005

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References

REFERENCES

1. Benoit, J., Mat. Sci. Eng B, B51, 254 (1998).Google Scholar
2. Elwenspoek, M. and Wiegerink, R., Mechanical Microsensors, (2001).Google Scholar
3. ASTM, Standard E 399: Standard test method for plane-strain fracture toughness testing of metallic materials, Annual Book of ASTM Standards, (1997) pp.443–473.Google Scholar
4. Ichikawa, Y., Maekawa, S., Takashima, K., Shimojo, M., Higo, Y. and Swain, M.V., in Materials Science of Microelectromechanical Systems (MEMS) Devices II, edited by de Boer, M.P., Heuer, A.H., Jacobs, S.J. and Peeters, E., (Mater. Res. Soc. Proc. 605, Pittsburgh, PA, 2000), pp.273–278.Google Scholar
5. Takashima, K., Ogura, A., Ichikawa, Y. and Higo, Y., in Materials Science of Microelectromechanical systems (MEMS) Devices III, edited by Kahn, H., de Boer, M.P., Judy, M. and Spearing, S.M., (Mater. Res. Soc. Proc. 657, Pittsburgh, PA, 2001) pp.EE5.12.1–6.Google Scholar
6. Takashima, K., Halford, T.P., Rudinal, D., Higo, Y. and Bowen, P., in Thin Films- Stressses and Mechanical Properties X, edited by Corcoran, S.G., Juo, Y-C., Moody, N.R., Suo, Z., (Mater. Res. Soc. Proc. 605, Pittsburgh, PA, 2004), pp.153–158.Google Scholar
7. Pather, R., Wisbey, A., Partridge, A., Halford, T., Horspool, D.N., Bowen, P. and Kestler, H.., in Proceedings of third International Symposium on Structural Intermetallics (ISSI 3), Structural Intermetallics 2001, edited by Hemker, K.J., Dimiduk, D.M., et al. (TMS, Warrendale, PA, 2002) pp 207–215.Google Scholar
8. Higo, Y., Takashima, K., Shimojo, M., Sugiura, S., Pfister, B. and Swain, M.V., in Materials Science of Microelectromechanical Systems (MEMS) Devices II, edited by de Boer, M.P., Heuer, A.H., Jacobs, S.J. and Peeters, E., (Mater. Res. Soc. Proc. 605, Pittsburgh, PA, 2000), pp.241–246.Google Scholar