Hostname: page-component-586b7cd67f-l7hp2 Total loading time: 0 Render date: 2024-11-29T07:46:06.132Z Has data issue: false hasContentIssue false
  • English
  • Français

Fatigue of Aluminum Films Leading to Melting by Multiple Laser Pulses*

Published online by Cambridge University Press:  28 February 2011

Joseph B. Bernstein ,
Simon S. Cohen  and
Peter W. Wyatt
Joseph B. Bernstein
Affiliation:
MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02173
Simon S. Cohen
Affiliation:
MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02173
Peter W. Wyatt
Affiliation:
MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02173
Get access

Abstract

Repeated laser pulses at a single point on an aluminum thin film can reduce the power needed to melt or damage the surface as compared with CW application. This multi-pulse effect was found to depend on metal thickness and number of pulses, while being weakly dependent on the pulse length. This behavior appears to result from cumulative mechanical fatigue due to cyclic thermal stress in excess of the aluminum yield stress. This principle has been applied to cutting metal wires in microelectronic applications for deletive redundancy. The results suggest a significant advantage over CW laser application since the power needed to cut a metal wire is reduced by more than 70%, and 87% as compared to a single pulse.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 235: Symposium A – Phase Formation and Modification by Beam-Solid Interactions , 1991 , 589
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

*

This work was sponsored by the Department of the Air Force

References

REFERENCES

[1] Thomas, S.R., Harrison, R.F., and Figueira, J.F., Appl. Phys. Lett. 40, 200 (1982)Google Scholar
[2] Porteus, J.O., Decker, D.L., Faith, W.N., Grandjean, D.J.;, Seitel, S.C., and Soileau, M.J., IEEE J. of Quant. Elect. 17, 2078 (1981)Google Scholar
[3] Ursu, I., Apostol, I., Mihailescu, I.N., Popa, A., Prokhorov, A.M., Konov, V.I., and Chapliev, N.I., Appl. Phys. A 34, 133 (1984)Google Scholar
[4] Chapman, G.H. and Cohen, S.S., Tech. Proc. of the Conf. on Lasers and Electro-Optics (Optical Society of America, Washington DC 1991)Google Scholar
[5] Bernstein, J.B., Cohen, S.S., and Wyatt, P.W., Tech. Proc. of the Conf. on Lasers and Electro-Optics (Optical Society of America, Washington DC 1991)Google Scholar
[6] Cohen, S.S., Wyatt, P.W., and Chapman, G.H. IEEE Trans. Elec. Dev. 38, 2042 (1991)CrossRefGoogle Scholar
[7] Bechtel, J.H., J. Appl. Phys. 46, 1585 (1975)Google Scholar
[8] Ready, J.F., IEEE J. of Quant. Elect. Vol. 12 137 (1976)Google Scholar
[9] Prokhorov, A.M., Konov, V.I., Ursu, I., and Mihailescu, I.N., Laser Heating of Metals (Adam Hilger, Bristol 1990)Google Scholar
[10] Wood, R.M., Laser Damage in Optical Materials, (Adam Hilger, Bristol (1986)Google Scholar
[11] Chapman, G.H., Canter, J.M., and Cohen, S.S., Proc. of Int. Conf. on Wafer Scale Integration (IEEE Computer Society Press, 1989) p. 22 Google Scholar
[12] Raffel, J., Anderson, A.H., and Chapman, G.H., Wafer Scale Integration (Kluwer Academic 1989) p. 319 Google Scholar
[13] Cohen, S.S., Wyatt, P.W., Chapman, G.H., and Burns, J.A., IEEE Trans. Elec. Dev. 35, 1533 (1988)CrossRefGoogle Scholar
[14] McClintock, F.A and Argon Editors, A.S Mechanical Behavior of Materials (Addison Wesley, MA 1966)Google Scholar
[15] Manson, S.S., Thermal Stress and Low Cycle Fatigue, (McGraw-Hill, NY 1966)Google Scholar
[16] Boley, B.A. and Weiner, J.H.; Theory of Thermal Stresses (J. Wiley & sons inc., NY 1960)Google Scholar
[17] Zayhowski, J.J., Tech. Proc. of the Conf. on Lasers and Electro-tics (Optical Society of America, Washington DC 1991)Google Scholar