Hostname: page-component-cd9895bd7-gvvz8 Total loading time: 0 Render date: 2024-12-27T02:25:22.720Z Has data issue: false hasContentIssue false
  • English
  • Français

Fabrication and Hot Switching Behavior of Electroplated Gallium Spheres for MEMS

Published online by Cambridge University Press:  01 February 2011

Yoonkap Kim  and
David Bahr
Yoonkap Kim
Affiliation:
[email protected]@gmail.com, Washington State University, Mechanical and Materials Engineering, Pullman, Washington, United States
David Bahr
Affiliation:
[email protected], Washington State University, Mechanical and Materials Engineering, Pullman, Washington, United States
Get access

Abstract

Liquid metal microscale switches, often using mercury, are sometimes used in place of solid-solid contact switches because of the ability to minimize damage from switching and the ability to make good contacts for electrical and thermal conductivity. However, mercury has potential health and safety problems, and is difficult to use at high frequency (kHz) operation due to poor adhesion between the liquid-solid contacts. One alternative to the mechanical and chemical problems of a liquid mercury switch is using soft metals, such as gallium or tin, as a solid metal sphere for switches that can melt at moderate temperatures. Ga micro-spheres for switching operations were deposited on a substrate consisting of photolithographically patterned W films on SiO2 and Si substrates by electroplating, and the applicability for use in a microscale switch was investigated by characterizing the macro structure, hardness, and electrical performance during switching. The resistivity of the electroplated Ga droplets was similar to the theoretical value for pure Ga, and suggests that the electrodeposited Ga will be suitable for a solid MEMS switch. The hardness of the Ga sphere was 5.7 MPa. This suggests a maximum of ∼40 micron-Newton can be applied to each 50 micron-meter radius Ga contact in the current configuration for switching applications. When the Ga spheres were investigated for electrical performance during hot switching, the resistance increased over six switching cycles, but the original lower resistivity was recovered after a 393 K thermal reflow process.

Keywords

microelectro-mechanical (MEMS)Gaelectrodeposition
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1139: Symposium GG – Microelectromechanical Systems–Materials and Devices II , 2008 , 1139-GG03-05
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Madou, M., Fundamentals of Microfabrication, CRC Press, New York, 1997.Google Scholar
2. Witvrouw, A., Tilmans, H.A.C., De Wolf, I., Microelectronic Engineering 76 (2004), 245–257.Google Scholar
3. Petersen, K., Proceedings of the IEEE, Vol. 70, No. 5, May 1982, pp. 420–457.Google Scholar
4. Sakata, M., Proceedings of the Tech Digest IEEE Micro Electro Mechanical Systems, Salt Lake City, UT, USA, February 1989, pp. 149–151.Google Scholar
5. Roy, S., and Mehregany, M., Proceeding of the IEEE MEMS Workshop, Amsterdam, The Netherlands, January-February 1995, pp. 353–357.Google Scholar
6. Hashimoto, E., Uenishi, Y., and Watabe, A., Proceeding of the International Conference on Solid-State Sensors and Actuators, Stockholm, Sweden, June 1995, pp. 361–364.Google Scholar
7. Sovero, E.A., Mihailovich, R., Deakin, D.S., Higgins, J.A., Yao, J.J., Denatale, J.F., and Hong, J.H., Proceedings of the SBMO/IEEE MTTT-S IMOC′99, 1, Rio de Janeiro, Brazil, August 1999, pp. 257–260.Google Scholar
8. Kim, J., Shen, W., Latorre, L., and Kim, C.J., Sensors and Actuators A, 97–98, 2002, pp. 672–679.Google Scholar
9. Simon, J., Saffer, S., and Kim, C.J., IEEE MEMS'96 Proceedings (1996), pp 515–520.Google Scholar
10. Taylor, L.T., Rancourt, J., and Perry, C.V., United States Patent Number 5478978, 1995.Google Scholar
11. Sundararajan, S. and Bhat, T.R., J.Less-common Metals, 11, 1966, pp. 360–364.Google Scholar
12. Breteque, P.D.L., Industrial and Engineering Chemistry, 56, 1964, pp. 54–55.Google Scholar
13. Dieter, G.E., McGraw-Hill Book Company, London, 1988.Google Scholar
14. Meyers, M.A. and Chawla, K.K., Prentice-Hall, New Jersey, 1984.Google Scholar
15. Doelling, C.M. and Vanderlick, T.K., J.Applied Physics 101, 2007, p. 124303.Google Scholar