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Fabrication and Characterization of Spin-On Silica Xerogel Films

Published online by Cambridge University Press:  10 February 2011

S. Nitta ,
A. Jain ,
V. Pisupatti ,
W. N. Gill ,
P. C. Wayner Jr  and
J. L. Plawsky
S. Nitta
Affiliation:
Dept. of Chem. Engng., Rensselaer Polytechnic Institute, Troy, NY 12180
A. Jain
Affiliation:
Dept. of Chem. Engng., Rensselaer Polytechnic Institute, Troy, NY 12180
V. Pisupatti
Affiliation:
Dept. of Chem. Engng., Rensselaer Polytechnic Institute, Troy, NY 12180
W. N. Gill
Affiliation:
Dept. of Chem. Engng., Rensselaer Polytechnic Institute, Troy, NY 12180
P. C. Wayner Jr
Affiliation:
Dept. of Chem. Engng., Rensselaer Polytechnic Institute, Troy, NY 12180
J. L. Plawsky
Affiliation:
Dept. of Chem. Engng., Rensselaer Polytechnic Institute, Troy, NY 12180
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Abstract

Xerogel films of high porosity were fabricated using an ambient pressure technique. The same porosity can be obtained with different microstructures by varying the aging time of the films. The dielectric constant of these films as a function of porosity at 1 MHz follows correlations originally developed for bulk aerogels. Diffusion of copper is orders of magnitude faster in these xerogels than in the corresponding thermal oxide. An activation energy of 0.9 eV was estimated based on a convective diffusion model.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 511: Symposium E – Low Dielectric Constant Materials IV , 1998 , 99
Copyright
Copyright © Materials Research Society 1998

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