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Fabrication and Characterization of Nife Thin Film Composition Modulated Alloys

Published online by Cambridge University Press:  10 February 2011

S. D. Leith
Affiliation:
University of Washington, Department of Chemical Engineering, Box 351750, Seattle, WA 98195–1750
D. T. Schwartz
Affiliation:
University of Washington, Department of Chemical Engineering, Box 351750, Seattle, WA 98195–1750
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Abstract

Described are results showing that an oscillating flow-field can induce spatially periodic composition variations in electrodeposited NiFe films. Flow-induced NiFe composition modulated alloys (CMA's) were deposited on the disk of a rotating disk electrode by oscillating the disk rotation rate during galvanostatic plating. Deposit composition and structure were investigated using potentiostatic stripping voltammetry and scanning probe microscopy. Results illustrate a linear relationship between the composition modulation wavelength and the flow oscillation period. CMA's with wavelengths less than 10 nm can be fabricated when plating with a disk rotation rate oscillation period less than 3 seconds.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

REFERENCES

1. Judy, J.H., MRS Bull., 15, 63 (1990).Google Scholar
2. Andricacos, P.C. and Romankiw, L.T., in Advances in Electrochemical Science and Engineering, edited by Genscher, H. and Tobias, C.W., (VCH Publishers, New York, 1994), Vol. 3, pp. 227.Google Scholar
3. Jagielinski, T., MRS Bull., 15, 36 (1990).Google Scholar
4. Schwartz, D.T., J. Electrochem. Soc, 136, 53C (1989).Google Scholar
5. Schwartz, D.T., Stroeve, P., and Higgins, B.G., AIChE J., 35, 1315 (1989).Google Scholar
6. Leith, S.D. and Schwartz, D.T., J. Electrochem. Soc, 143, 873 (1996).Google Scholar
7. Newman, J., J. Electrochem. Soc, 113, 1235 (1966).Google Scholar