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Experimental Evaluation of Mechanical Behavior of GaAs Wafer Material

Published online by Cambridge University Press:  26 February 2011

Jun Ming Hu ,
Michael Pecht  and
Donald Barker
Jun Ming Hu
Affiliation:
CALCE Center For Electronics Packaging, University of Maryland, College Park, MD 20742
Michael Pecht
Affiliation:
CALCE Center For Electronics Packaging, University of Maryland, College Park, MD 20742
Donald Barker
Affiliation:
CALCE Center For Electronics Packaging, University of Maryland, College Park, MD 20742
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Abstract

The mechanical behavior of non-metalized GaAs wafer material at different temperatures were evaluated. The material properties of GaAs, including the modulus of elasticity, the modulus of rupture, the critical value of stress intensity factor, and the coefficient of thermal expansion, were experimentally determined over various temperature ranges.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 226: Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics , 1991 , 141
Copyright
Copyright © Materials Research Society 1991

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References

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