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Experimental Determination of the Strain Transfer Across a Flexible Intermediate Layer in Thin Film Structures as a Function of Flexible Layer Thickness

Published online by Cambridge University Press:  22 February 2011

L. S. Schadler  and
I. C. Noyan
L. S. Schadler
Affiliation:
IBM Research Division, T. J.Watson Research Center, PO Box 218, Yorktown Heights, NY 10598
I. C. Noyan
Affiliation:
IBM Research Division, T. J.Watson Research Center, PO Box 218, Yorktown Heights, NY 10598
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Abstract

The tensile deformation behavior of nickel/ polyimide-thin-film / copper-thin-film structures is observed using an in situ x-ray stress analysis technique. The x-ray stress is measured in the nickel and the copper simultaneously. From the analysis, the stress/strain transfer from the nickel through the polyimide to the copper can be measured.

The effect of polyimide thickness (in the range from no polyimide to 33μm of polyimide) on the stress/strain transfer behavior is reported here.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 151
Copyright
Copyright © Materials Research Society 1992

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References

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