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Excimer Laser Removal of Cr Contaminants from Polyimide Surfaces for Packaging Applications

Published online by Cambridge University Press:  25 February 2011

Gouri Radhakrishnan ,
Nicholas Marquez  and
Heinrich MÜller
Gouri Radhakrishnan
Affiliation:
The Aerospace Corporation, MS M2-241, P.O. Box 92957, Los Angeles, CA 90009
Nicholas Marquez
Affiliation:
The Aerospace Corporation, MS M2-241, P.O. Box 92957, Los Angeles, CA 90009
Heinrich MÜller
Affiliation:
Microelectronics and Computer Technology Corporation, 12100 Technology Blvd., Austin, TX 78727
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Abstract

Excimer laser radiation at 248 nm has been used for the maskless and selective removal of chromium (Cr) contamination from polyimide surfaces containing gold (Au) metallizations. Ablation thresholds and rates have been determined in air, vacuum, and oxygen. These results have been used to establish the optimum ablation medium and a corresponding process window that allows for selective removal of Cr from polyimide. The substantial differences between the ablated and unexposed regions of the polyimide surface have been established by electrical measurements, while the variations in their respective surface morphologies have been examined using optical and scanning electron microscopy. Quantitative determinations of Cr on the ablated and unablated regions of polyimide have been performed, using secondary ion mass spectrometry, to establish the threshold for the complete removal of Cr.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 236: Symposium B – Photons and Low Energy Particles in Surface Processing , 1991 , 77
Copyright
Copyright © Materials Research Society 1992

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References

1. Brannon, J.H., Lankard, J.R., Baise, A.I., Burns, F., and Kaufman, J., J. Appl. Phys. 58, 2036 1985.Google Scholar
2. Srnivasan, R., Braren, B., and Dreyfus, R.W., J. Appl. Phys. 61, 372 1987.Google Scholar
3. Srinivasan, R. and Braren, B., J. Polym. Sci. 22, 2601 1984.Google Scholar
4. Singleton, D., Paraskevopoulos, G., and Irwin, R.S., J. Appl. Phys. 6, 3324 1989.Google Scholar
5. Andrew, J.E., Dyer, P.E., Forster, D., and Key, P.H., Appl. Phys. Lett. 43, 717 1983.Google Scholar
6. Braren, B. and Seeger, D., J. Polym. Sci. 24, 371 1986.Google Scholar
7. Brannon, J.H., Scholl, D., and Kay, E., Appl. Phys. A52, 160 1991.Google Scholar
8. Dyer, P.E. and Srinivasan, R., J. Appl. Phys. 66, 2608 1989.Google Scholar
9. Srinivasan, R., Braren, B., Casey, K.G., and Yeh, M., Appl. Phys. Lett. 5, 2790 1989.Google Scholar
10. Chuang, T.J., Hiraoka, H., and Modl, A., Appl. Phys. A45, 277 1988.Google Scholar
11. Srinivasan, R. and Braren, B., Appl. Phys. A45, 289 1988.Google Scholar
12. Bachman, F., MRS Bulletin 6, 49 1989.Google Scholar
13. Brannon, J.H., J. Vac. Sci. Technol. 17, 1064 1989.Google Scholar
14. Liu, Y.S. and Grubb, W.T., Patent, U.S. No. 4,882,200 (21 November, 1989).Google Scholar
15. Niino, H. and Yabe, A., CLEO, Technical Digest Series, 10, 286 1991.Google Scholar