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Excimer Laser Recrystallization of Selectively Floating a-Si Active Layer for Large-Grained Poly-Si Film

Published online by Cambridge University Press:  17 March 2011

Cheon-Hong Kim
Affiliation:
School of Electrical Engineering, Seoul National University, San 56-1 Shinlim-dong, Kwanak-gu, Seoul 151-742, Korea
Juhn-Suk Yoo
Affiliation:
School of Electrical Engineering, Seoul National University, San 56-1 Shinlim-dong, Kwanak-gu, Seoul 151-742, Korea
In-Hyuk Song
Affiliation:
School of Electrical Engineering, Seoul National University, San 56-1 Shinlim-dong, Kwanak-gu, Seoul 151-742, Korea
Min-Koo Han
Affiliation:
School of Electrical Engineering, Seoul National University, San 56-1 Shinlim-dong, Kwanak-gu, Seoul 151-742, Korea
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Abstract

We report a new excimer laser annealing method by employing selectively floating a-Si active layer structure in order to increase the grain size of poly-Si film. The floating a-Si region blocks the heat conduction into the underlying substrate due to high thermal-insulating property of an air so that the lateral temperature gradient is successfully induced by the proposed simple air-gap structure. Our experimental results show that large grains were grown in the lateral direction from the edge to the center of the floating active region. The large grains exceeding 4 m were successfully obtained with only one laser irradiation.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

1. Hack, M., Mei, P., Lujan, R. and Lewis, A. G., JNCS 164–166, 727730 (1993).Google Scholar
2. Im, J. S., and Kim, H. J., Appl. Phys. Lett. 63, 1969 (1993).Google Scholar
3. Jeon, J. H., Lee, M. C., Park, K. C., Jung, S. H., and Han, M. K., IEDM Tech. Dig., 213 (2000).Google Scholar
4. Sposili, R. S. and Im, J. S., Appl. Phys. Lett. 69, 2864 (1996).10.1063/1.117344Google Scholar
5. Choi, D. H., Shimizu, K., Sugiura, O. and Matsumura, M., Jpn. J. Appl. Phys. 31, 4545 (1992).Google Scholar