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Exchange Coupling and Giant Magnetoresistance in Electrodeposited Co/Cu Multilayers
Published online by Cambridge University Press: 15 February 2011
Abstract
We present the results of the transport and magnetization measurements of electrodeposited Co/Cu multilayers grown in a single electrolyte based on C0SO4, H3BO3 and CuSO4. The samples are deposited on glass substrate covered by a 500 Å thick Cu buffer layer. X-ray diffraction performed on the samples shows fee structure of both Co and Cu layers with preferential (111) orientation. Resistivity measurements show a giant magnetoresistance effect of about 4% at room temperature for multilayers with Co and Cu thickness between 4 nm ≤ tco ≤ 6 nm and 3 nm ≤ tcu ≤4 nm respectively. For Co thickness tCo ≤ 15 nm, the magnetoresistance completely vanishes indicating that there is no more continuous Co layer. The indirect antiferromagnetic exchange coupling between magnetic Co layers is relatively large for 4 nm thick Cu spacer layer and gives rise to a temperature dependence of about 30% between room temperature and 4.2 K.
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- Copyright © Materials Research Society 1997
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