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Evolution of the Electrical Properties of Interconnects Under Electromigration Stress

Published online by Cambridge University Press:  10 February 2011

B.K. Jones ,
Jianping Guo ,
Yanzhong Xu  and
G. Trefan
B.K. Jones
Affiliation:
Department of Physics, Lancaster University, Lancaster, LA1 4YB, [email protected]
Jianping Guo
Affiliation:
Department of Physics, Lancaster University, Lancaster, LA1 4YB, [email protected]
Yanzhong Xu
Affiliation:
Department of Physics, Lancaster University, Lancaster, LA1 4YB, [email protected]
G. Trefan
Affiliation:
Department of Physics, Lancaster University, Lancaster, LA1 4YB, [email protected]
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Abstract

We report experimental results of measurements of the changes in the resistance and thermal non-linearity of a variety of samples during accelerated electromigration stress to failure. The value of the extra measurement of the second harmonic of the AC bridge signal is illustrated by observations of changes in the thermal conductance to the substrate and the temperature coefficient of resistivity which are not detected by the resistance measurement. These quantities are also larger than the resistance measurement.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 516: Symposium E – Low Dielectric Constant Materials IV , January 1998 , 9
Copyright
Copyright © Materials Research Society 1998

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References

1. Jones, B.K., “Microscopic measurements of electromigration damage using electrical measurements”, Mat. Res. Soc. Symp. Proc. 391, 489–500, 1995.10.1557/PROC-391-489Google Scholar
2. Jones, B.K. and Xu, Y.Z., “Measurement of the electrical properties of electromigration specimens”, Rev. Sci. Instrum. 66, 4676–80 (1995).10.1063/1.1145306Google Scholar
3. de Ceuninck, W.A., D'Haeger, V., Van Olmen, J., Witvrouw, A., Maex, K., De Schepper, L., De Pauw, P. and Pergoots, A., “The influence of addition elements on the early resistance changes observed during electromigration testing of Al metal lines”, Microelectron. Reliab. 38, 87–98 (1998).10.1016/S0026-2714(97)00064-4Google Scholar
4. Shih, W.C., Greer, A.L., Xu, Y.Z. and Jones, B.K., “Microstructure, damage and resistance during electromigration life-testing of Al-Cu interconnects”, Mater. Res. Soc. Symp. Proc. 309, 369, 1993.10.1557/PROC-309-369Google Scholar