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Evolution of Residual Stresses in Thin Films Deposited on Mechanically Strained Substrates

Published online by Cambridge University Press:  25 February 2011

G. Sheikh ,
A. Berger  and
I. C. Noyan
G. Sheikh
Affiliation:
Now atColumbia University, Department of Metallurgical and Mining Engineering, New York, NY
A. Berger
Affiliation:
Now atHarvard University, Department of Physics, Cambridge, MA
I. C. Noyan
Affiliation:
IBM Research Division, T.J. Watson Research Center, Yorktown Heights, NY
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Abstract

A simple model for the formation of residual stresses in thin films deposited on elastically strained substrates was derived and experimentally tested. In the experiments, Cu thin films were deposited on elastically stretched nickel substrates. These Cu films were2 to 4.m thick and were deposited through vapor phase evaporation or electroplating. The loads applied during the deposition were then relaxed, and the total stress in both the film and the substrate were monitored (by x-ray diffraction) during this relaxation. It was seen that the final (residual) film stresses were significantly different for bothdeposition methods. The causes of such differences are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 153
Copyright
Copyright © Materials Research Society 1991

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References

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