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Evaluation of TiTe2 as a Diffusion Barrier in the Synthesis of (Bi2Te3)5(SnTe)5 Misfit Layer Compound

Published online by Cambridge University Press:  01 February 2011

Sissi L. Li  and
David C. Johnson
Sissi L. Li
Affiliation:
[email protected], University of Oregon, Chemistry, 1253 University of Oregon, Eugene, OR, 97403, United States, 5419143253
David C. Johnson
Affiliation:
[email protected], University of Oregon, Chemistry, United States
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Abstract

The evolution of modulated reactants designed to form (Bi2Te3)5(TiTe2)5(SnTe)5(TiTe2)5 and (Bi2Te3)5(SnTe)5 are compared and contrasted. The modulated reactant designed to form (Bi2Te3)5(SnTe)5 interdiffused at 220°C forming SnBi2Te4 rather than the desired superlattice structure. The second sample was designed to have TiTe2 as a potential diffusion barrier to prevent the formation of SnBi2Te4. This second sample remained layered after annealing at 220°C. SnTe crystals are observed in the high angle diffraction pattern after this annealing, but there is evidence for the beginning of SnBi2Te4 formation. Annealing this sample at 300°C results in the formation of SnBi2Te4. The interdiffusion of Sn and Bi appears to occur before the formation of the desired TiTe2 structure.

Keywords

thermoelectricitylayeredthermal conductivity
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 886: Symposium F – Materials and Technologies fore Direct Thermal-to-Electric Energy Conversion , 2005 , 0886-F03-12
Copyright
Copyright © Materials Research Society 2006

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References

REFERENCES

1. Rowe, D. M. CRC Handbook of Thermoelectrics. CRC Press, Inc.: Boca Raton, 1995.Google Scholar
2. Venkatasubramanian, R.; Siivola, E.; Colpitts, T.; O'Quinn, B. Nature. 2001, 413, 597–602.Google Scholar
3. Tritt, T.M. Thermal Conductivity; Theory, Properties, and Applications. Kluwer Academic: New York, 2004.Google Scholar
4. Meerchaut, A. Current Opinion in Solid State & Mater. Sci. 1996, 1, 250–260.Google Scholar
5. Cahill, D.G.; Ford, W.K.; Mahan, G.D.; Majumdar, A; Maris, H.J.; Merlin, R.; Phillpot, S.R. J of Appl. Phys. 2003, 93(2), 793–817.Google Scholar
6. Kittel, C. Introduction to Solid State Physics. 7th ed. John Wiley & Sons, Inc.: New York, 1996.Google Scholar
7. Li, S.L.; Smeller, M.; Johnson, D.C. Proc. XXIV Int. Conf. on Thermoelectrics, 2005, 24, 284–285.Google Scholar
8. Mortensen, C.; Rostek, R.; Schmid, B.; Johnson, D.C. Proc. XXIV Int. Conf. on Thermoelectrics, 2005, 24, 261–265.Google Scholar