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Epitaxial Growth of Highly Crystallized InSb films on Si Substrate by MBE and Their Devices Properties

Published online by Cambridge University Press:  31 January 2011

Yoshihisa Kunimi
Affiliation:
[email protected], Asahi Kasei Microdevices Corporation, Magnetic Sensor Process Technology & Development, Fuji, Japan
Hiromi Fujita
Affiliation:
[email protected], Asahi Kasei Microdevices Corporation, Magnetic Sensor Process Technology & Development, Fuji, Japan
Ayano Sakurai
Affiliation:
[email protected], Asahi Kasei Microdevices Corporation, Magnetic Sensor Process Technology & Development, Fuji, Japan
Shinichiro Akiyama
Affiliation:
[email protected], Asahi Kasei Microdevices Corporation, Magnetic Sensor Process Technology & Development, Fuji, Japan
Masatoshi Miyahara
Affiliation:
[email protected], Asahi Kasei Microdevices Corporation, Magnetic Sensor Process Technology & Development, Fuji, Japan
Yoshihiko Shibata
Affiliation:
[email protected], Asahi Kasei Microdevices Corporation, Magnetic Sensor Process Technology & Development, Fuji, Japan
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Abstract

High crystallized thin InSb epitaxial growth directly on Si substrate was investigated by molecular-beam epitaxy (MBE). Experimental results indicated that suppressing the desorption of hydrogen atoms which terminated the dangling bonds of Si wafer surface and incorporation of As around the interface between film and Si substrate were the most important to obtained high crystallized InSb film. It could be achieved by the irradiation of As4 cluster beam onto the Si wafer just before film growth. Obtained thin InSb film showed mirror like surface, and its thickness was 0.7 μm. Its electron mobility was 47,600 cm2/V-s, and FWHM of HR-XRD rocking curve was about 300 arcsec. This InSb film on Si wafer was applied to Hall element, and it passed ordinary reliability tests.

Type
Research Article
Copyright
Copyright © Materials Research Society 2010

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