Hostname: page-component-78c5997874-t5tsf Total loading time: 0 Render date: 2024-11-19T23:56:28.799Z Has data issue: false hasContentIssue false

Epitaxial Growth of Cu Thin Films on (111)Si at Room Temperature

Published online by Cambridge University Press:  15 February 2011

C. S. Liu
Affiliation:
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan, Republic of China
L. J. Chen
Affiliation:
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan, Republic of China
Get access

Abstract

Epitaxial growth of Cu thin films on atomically cleaned (111)Si has been studied by transmission electron microscopy (TEM), x-ray diffractometry (XRD) and Auger electron spectroscopy (AES). An interface compound, CuSix with x= 11.2 to 14 at.%, was observed to be present at the Cu/Si interface. Interfacial dislocations at the silicide/Si interface were identified to be of edge type with 1/2<110> Burgers vectors. η“-Cu3Si was found to form in samples annealed at 200 °C for 1 h. Solid phase epitaxial growth of silicon on (111)Si was observed to occur at a temperature as low as 200 °C. Polycrystalline η”-Cu3Si is the only phase present in samples annealed at 200–800 °C. In samples annealed at or higher than 850 °c, a mixture of η′-Cu3Si and η“-Cu3Si were found to be present.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Miyazaki, H., Hinode, K., Homma, Y., and Mukai, K., Jpn. J. Appl. Phys. 48, 329 (1987).Google Scholar
2. Ohmi, T., Shibata, T., and Nitta, T., Appl. Phys. Lett. 52, 2236 (1988).CrossRefGoogle Scholar
3. Bai, P., Yang, G.R., You, L., Lu, T.M., and Koorr, D.S., J. Mater. Res. 5, 989 (1990).CrossRefGoogle Scholar
4. Chang, Chin-An, Appl. Phys. Lett. 55, 2734 (1989).Google Scholar
5. Chang, Chin-An, J. Appl. Phys. 67, 566 (1990).CrossRefGoogle Scholar
6. Cros, A., Aboelfotoh, M.D, and Tu, K. N., J. Appl. Phys. 67, 3328 (1990).CrossRefGoogle Scholar
7. Stolt, L. and d'Heeurle, F.M., Thin Solid Films 189, 269 (1990).CrossRefGoogle Scholar
8. Stolt, L., d'Heeurle, F.M., and Harper, J.M.E., Thin Solid Films 200, 147 (1991).CrossRefGoogle Scholar
9. Hong, S.Q., Comrie, C. M., Russell, S.W., and Mayer, J.W., J. Appl. Phys. 70, 3655 (1991).CrossRefGoogle Scholar
10. Ecchigoya, J., Enoki, H., Satoh, T., Waki, T., Ohmi, T., Otsuki, M., and Shibata, T., Appl. Surf. Sci. 56–58, 463 (1992).CrossRefGoogle Scholar
11. Pashley, D.W., in “Epitaxial Growth”, edited by J.W., Matthews (Academic, New York, 1975) p. 1.Google Scholar
12. Stowell, M.J., in “Epitaxial Growth”, edited by J.W., Matthews (Academic, New York, 1975) p. 437.CrossRefGoogle Scholar
13. Hansen, M. and Anderko, K., Constitution of Binary Alloys (McGraw-Hill, New York, 1958) p. 629.Google Scholar
14. Elliot, R.P., Constitution of Binary Alloys, First Supplement (McGraw-Hill, New Yok, 1965) p. 384.Google Scholar
15. Nicolet, M.A. and Lau, S.S., in Materials and Process Characterization, edited by N.G., Einspruch and G.B., Larrabee (Academic, New York, 1983) p. 329.CrossRefGoogle Scholar