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Enhanced Chemical Bonding at the Fiber-Matrix Interphase in Microwave Processed Composites

Published online by Cambridge University Press:  28 February 2011

L. T. Drzal ,
K. J. Hook  and
R. K. Agrawal
L. T. Drzal
Affiliation:
Composite Materials and Structures Center, Department of Chemical Engineering, Michigan State University, East Lansing, Michigan 48824-1326
K. J. Hook
Affiliation:
Composite Materials and Structures Center, Department of Chemical Engineering, Michigan State University, East Lansing, Michigan 48824-1326
R. K. Agrawal
Affiliation:
Composite Materials and Structures Center, Department of Chemical Engineering, Michigan State University, East Lansing, Michigan 48824-1326
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Abstract

The effect of microwave processing on the chemical interactions occurring between the carbon fiber surface and the epoxy matrix constituents was investigated using X-ray Photoelectron Spectroscopy (XPS). Monofunctional model compounds of the matrix constituents were exposed to the carbon fibers at temperatures similar to those encountered during composite processing. The microwave treatment resulted in a substantial increase in the amount of chemical interaction between the fiber surface and the epoxy resin but little difference for the amine component of the matrix when compared to thermal processing. An epoxy resin/amine hardener adduct compound used to determine the hydroxyl group interaction with the carbon fiber surface indicated a low level of chemical interaction of the hydroxyl with the carbon fiber surface under the conditions used in this study.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 189: Symposium L – Microwave Processing of Materials II , 1990 , 449
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

1. Agrawal, R. K. and Drzal, L. T., J. Adhesion, 29, 63–79 (1989)Google Scholar
2. Sherwood, P. M. A. and Xie, Y. Appl. Spec., 43(7), 1153, (1989)Google Scholar
3. Clark, D. T. and Thomas, H. R., J. Polym. Sci., Polm. Chem. Ed., 16, 791, (1978)Google Scholar
4. Drzal, L.T., Rich, M.J., and Lloyd, P. F., J. Adhesion, 16, 1–30, (1983).Google Scholar
5. Proctor, A. and Sherwood, P. M. A., J. Electron Spec., 27, 39, (1982)Google Scholar
6. Hook, K. J., Agrawal, R. K. and Drzal, L. T., J. Adhesion, (in press)Google Scholar