Hostname: page-component-cd9895bd7-lnqnp Total loading time: 0 Render date: 2024-12-27T02:30:39.176Z Has data issue: false hasContentIssue false
  • English
  • Français

Enhanced [111] Preferred Orientation of Ag Thin Film on Amorphous SiO2 by Cu Addition

Published online by Cambridge University Press:  01 February 2011

Yeongseok Zoo ,
Hauk Han  and
Terry L. Alford
Yeongseok Zoo
Affiliation:
[email protected], Arizona State University, School of Materials, university drive and mill avenue, tempe, AZ, 85287, United States
Hauk Han
Affiliation:
[email protected], Arizona State University, School of Materials, tempe, AZ, 85287-8706, United States
Terry L. Alford
Affiliation:
[email protected], Arizona State University, School of Materials, tempe, AZ, 85287-8706, United States
Get access

Abstract

Small amounts of copper were added to enhance the adhesion and minimize agglomeration of Ag thin films on SiO2 substrates. Comparison of texture profiles between Ag and Ag(Cu) thin films showed that Cu additions enhanced (111) texture in Ag thin films. For the case of Ag film, (111) texture was enhanced mainly by recrystallization of amorphous regions during annealing. In addition to the recrystallization, (111) texture enhancement in Ag(Cu) film attributes to the dissociation of grains with other crystallographic orientations.

Keywords

Agx-ray diffraction (XRD)texture
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 990: Symposium B – Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics , 2007 , 0990-B08-06
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Kim, H.C., Alford, T.L., and Allee, D.R., Appl. Phys. Lett. 81, 4287 (2002).Google Scholar
2 Kim, H.C., Theodore, N.D., and Alford, T.L., J. Appl. Phys. 95, 5180 (2004).Google Scholar
3 Jung, Y.S., Appl. Surf. Sci. 221, 281 (2004).Google Scholar
4 Tomov, I., Adamik, M., and Barna, P.B., Thin Solid Films 371, 17 (2000).Google Scholar
5 Klemmer, T.J., Inturi, V.R., and Barnard, J.A., J. Vac. Sci. Technol. A 15, 1190 (1997).Google Scholar
6 Murray, C.E., and Rodbell, K.P., J. Appl. Phys. 89, 2337 (2001).Google Scholar
7 Ferron, J., Gomez, L., Miguel, J.J. de, and Miranda, R., Phys. Rev. Lett. 93, 166107 (2004).Google Scholar
8 Barth, J.V., Brune, H., Fischer, B., Weckesser, J., and Kern, K., Phys. Rev. Lett. 84, 1732 (2000).Google Scholar
9 Zoo, Y., Han, H., Alford, T.L., will be submitted to J. Appl. Phys.Google Scholar