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Electrostatic Adhesion Testing for the Evaluation of Metallization Adhesion

Published online by Cambridge University Press:  10 February 2011

H. S. Yang ,
F. R. Brotzen ,
D. L. Callahan  and
C. F. Dunn
H. S. Yang
Affiliation:
Rice University, Department of Mechanical Engineering and Materials Science Houston, TX 77030–1892
F. R. Brotzen
Affiliation:
Rice University, Department of Mechanical Engineering and Materials Science Houston, TX 77030–1892
D. L. Callahan
Affiliation:
Rice University, Department of Mechanical Engineering and Materials Science Houston, TX 77030–1892
C. F. Dunn
Affiliation:
Rice University, Department of Mechanical Engineering and Materials Science Houston, TX 77030–1892
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Abstract

Quantitative measurement of the adhesion strength of thin film metallizations has been achieved by a novel technique employing electrostatic forces to generate delaminating stresses. This technique has been used in testing the adhesion of Al-Cu, Cu, and Al multilayer films deposited on Si. Micro-blister-type failure is revealed by scanning electron microscopy. The delamination process and the geometry of the blister are discussed. The measured adhesion data fit a Weibull distribution function.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 473: Symposium J – Materials Reliability in Microelectronics VII , 1997 , 63
Copyright
Copyright © Materials Research Society 1997

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References

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