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Electrophoretic Deposition of Carbon Nanotubes into Device Structures: An Approach to Integrate Nanostructures into Micro devices

Published online by Cambridge University Press:  01 February 2011

Madhuri Guduru
Affiliation:
Louisiana Tech University, Institute for Micromanufacturing, P.O. Box 10137, Ruston, LA 71272–0001, U.S.A.
Anand Francis
Affiliation:
Louisiana Tech University, Institute for Micromanufacturing, P.O. Box 10137, Ruston, LA 71272–0001, U.S.A.
Tabbetha A. Dobbins
Affiliation:
Louisiana Tech University, Institute for Micromanufacturing, P.O. Box 10137, Ruston, LA 71272–0001, U.S.A.
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Abstract

Charged particles in suspension tend to move when an electric field is applied. This simple phenomenon of migration of charged particles in a liquid medium and their subsequent deposition onto an oppositely charged electrode is called electrophoretic deposition (EPD), and is used in assembly of nanoparticles into microfabricated devices. This work reports the application of the EPD process for deposition of commercially available purified single-walled carbon nanotubes (CNT) onto microfabricated device structures. A direct current EPD in aqueous medium was used to position CNTs into two different microfabricated device structures: gold electrodes of 100nm thickness and gold microcantilevers. Control of the mass of CNTs deposited using EPD process is addressed in this work.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

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References

REFERENCES

1. Kamat, P.V., Thomas, K.G., Barazzouk, S., Girishkumar, G., Vinodgopal, K., Meisel, D., J. Am. Chem. Soc., 126, 1075710762 (2004).Google Scholar
2. Crocker, J.C., Grier, D.G., Phys. Rev. Lett. 77[9] 26 (1996).Google Scholar
3. Talbot, J.B., Electrophoretic Deposition: Fundamentals and Applications. Electrochemical Society Proceedings 2002–21 128 (2002);Google Scholar
Kershner, R.J., Cima, M.J., Electrophoretic Deposition: Fundamentals and Applications. Electrochemical Society Proceedings 2002–21 1.Google Scholar
4. Gao, B., Yue, G.Z., Qiu, Q., Cheng, Y., Shimoda, H., Fleming, L., Zhou, O., Advanced Materials 13 1770 (2001).Google Scholar
5. Bae, J.C., Yoon, Y.J., Lee, S-J, Baik, H.K., Physica B: Condens. Matter 323 168 (2002).Google Scholar
6. Kurnosov, D.A., Baturin, A.S., Bugaev, A.S., Nikolski, K.N, Tchesov, R.G., Sheshin, E.P., Appl. Surf. Sci. 215[1–4] (2003) pp 232236.Google Scholar
7. Tang, Y., Fang, J., Yan, X., Ji, H-F, Sensor and Actuators B 97 109 (2004).Google Scholar
8. Tang, Y., Xu, X., Fang, J., Ji, H.-F., Anal. Chem. 76 2478 (2004);Google Scholar
Xu, X., Thundat, T., Brown, G. M., and Ji, H. F., Anal. Chem. 74 3611 (2002).Google Scholar