Hostname: page-component-cd9895bd7-gvvz8 Total loading time: 0 Render date: 2024-12-27T02:00:27.706Z Has data issue: false hasContentIssue false

Electronic Properties Of Defects Formed In n-Si During Sputter-Etching In An Ar Plasma

Published online by Cambridge University Press:  15 February 2011

P. N. K. Deenapanray
Affiliation:
Department of Physics, University of Pretoria, Pretoria 0002, [email protected]
F. D. Auret
Affiliation:
Department of Physics, University of Pretoria, Pretoria 0002, [email protected]
C. Schutte
Affiliation:
Department of Physics, University of Pretoria, Pretoria 0002, [email protected]
G. Myburg
Affiliation:
Department of Physics, University of Pretoria, Pretoria 0002, [email protected]
W. E. Meyer
Affiliation:
Department of Physics, University of Pretoria, Pretoria 0002, [email protected]
J. B. Malherbe
Affiliation:
Department of Physics, University of Pretoria, Pretoria 0002, [email protected]
M. C. Ridgway
Affiliation:
Department of Electronic Materials Engineering, Australian National University, Canberra, ACT 2601
Get access

Abstract

We have employed current-voltage (IV), capacitance-voltage (CV) and deep level transient spectroscopy (DLTS) techniques to characterise the defects induced in n-Si during RF sputter-etching in an Ar plasma. The reverse leakage current, at a bias of 1 V, of the Schottky barrier diodes fabricated on the etched samples was found to decrease with etch time reaching a minimum at 6 minutes and thereafter increased. The barrier heights followed the opposite trend. The plasma processing introduced six prominent deep levels below the conduction band of the substrate. A comparison with the defects induced during high energy (MeV) alpha-particle, proton and electron irradiation of the same material revealed that plasma-etching created the VO- and VP-centres, and V2-10. Some of the remaining sputter-etching-induced (SEI) defects have tentatively been related to those formed during either 1 keV He- or Ar-ion bombardment.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Mullins, F.H. and Brunnschweiler, A., Solid State Electron. 19, p. 47 (1976).Google Scholar
2. Pearton, S.J., Hobson, W.S., Chakrabarti, U.K, Derkits, G.E. Jr., and Kinsella, A.P., J. Electrochem. Soc. 137 (12), p. 3892 (1990).Google Scholar
3. Oehrlein, G.S., Materials Science and Engineering B4, p. 441 (1989).Google Scholar
4. Awadelkarim, O.O., Gu, T., Mikulan, P.I., Ditizio, R.A. and Fonash, S.J., Appl. Phys. Lett. 62 (9), p. 958 (1993).Google Scholar
5. Hirai, M., Iwakuro, H., Ohno, J., and Kuroda, T., IEEE Transactions on Components, Hybrids, and Manufacturing Technology 13 (4), p. 629 (1990).Google Scholar
6. Troxell, J.R., Solid State Electronics 26, p. 539 (1983).Google Scholar
7. Lang, D.V., J. Appl. Phys. 45, p. 3014 (1974).Google Scholar
8. Zohta, Y. and Watanabe, M.O., J. Appl. Phys. 53, p. 1809 (1982)..Google Scholar
9. Rhoderick, E.H. and Williams, R.H, Metal-Semiconductor Contacts, 2nd ed. (Clarendon Press, Oxford, 1988), p. 38.Google Scholar
10. Fonash, S.J., Ashok, S. and Singh, Ranbir, Thin Film Solids 90, p. 231 (1982).Google Scholar
11. Auret, F.D., Goodman, S.A., Erasmus, R.M., Meyer, W.E. and Myburg, G., Nucl. Instr. And Meth. B 106 (1995) 323.Google Scholar
12. Ma, Q.Y., Schmidt, M.T., Wu, X., Evans, H.L. and Yang, E.S., J. Appl. Phys. 64, p. 2469 (1988).Google Scholar
13. Kimerling, L.C., Inst. Phys. Conf. Ser. 13, p. 221 (1977).Google Scholar
14. Deenapanray, P.N.K., Auret, F.D., Myburg, G. and Meyer, W.E., Demanet, C.M., unpublished.Google Scholar
15. Benton, J.L., Asom, M.T., Sauer, R. and Kimerling, L.C. in Identification of Interstitial Carbon Related Defects in Silicon, edited by Stavola, M., Pearton, S.J. and Davies, G. (Mater. Res. Soc. Proc. 104, Pittsburgh, PA, 1988) pp. 8591.Google Scholar
16. Svensson, B.G., Mohadjeri, B., Allen, A., Svensson, J.H. and Corbett, J.W., Phys. Rev. B 43, p. 2292 (1991).Google Scholar
17. Benton, J.L., Michel, J., Kimerling, L.C., Weir, B.E. and Gottscho, R.A., Journal of Electronic Materials 20, p. 643 (1991).Google Scholar