Hostname: page-component-586b7cd67f-t7czq Total loading time: 0 Render date: 2024-11-25T15:22:53.223Z Has data issue: false hasContentIssue false
  • English
  • Français

Electron-Beam Moiré Study Of Local Deformation In Conductive Adhesives

Published online by Cambridge University Press:  10 February 2011

E. S. Drexler  and
J. R. Berger
E. S. Drexler
Affiliation:
Materials Reliability Division, National Institute of Standards and Technology, Boulder, Colorado 80303
J. R. Berger
Affiliation:
Division of Engineering, Colorado School of Mines, Golden, Colorado 80401
Get access

Abstract

Electron-beam (e-beam) moiré is a recently developed technique for micro-mechanics. It allows one to combine the resolution of the scanning electron microscope (SEM) with the strain measurement capabilities of moiré. With e-beam moiré we are able to study locally the effect of temperatures ranging between −50 and 150 °C on conductive adhesives (CAs) and their interfaces. With this technique we measured the local displacements due to the thermal expansion of the copper and the CA. The modified lap-shear specimens were made of copper-to-copper attached with CAs and cured according to the manufacturer's instructions. A cross section of each material was polished and a moiré grating was written on the surface using e-beam lithography techniques. Digital images of the moiré were collected from the SEM at regular temperature intervals. The images were compared and the displacements measured. Local regions of large displacements were observed in the paste specimen. Permanent deformations in the film specimen resulted from exceeding the glass transition temperature of the CA.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 75
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Dally, J. W. and Read, D. T., Exp. Mach. 33, 270 (1993).Google Scholar
2 Kishimoto, S., Egashire, M., and Shina, N., J. Soc. Mat. Sci. Jpn. 40, 637 (1991).Google Scholar
3 Read, D. T. and Dally, J. W., ASME J. Appl. Mech. 61, 402 (1994).Google Scholar
4 Read, D. T. and Dally, J. W., J. Res. Nati. Inst. Stand. Technol. 101, 47 (1996).Google Scholar
5 Read, D. T. and Drexler, E. S., ASME Proc. Mech. Mat. Electron. Pack. AMD-187 2, 185 (1994).Google Scholar
6 Morimoto, Y. and Hayashi, T., Exp. Mech. 24, 112 (1984).Google Scholar