Hostname: page-component-586b7cd67f-t7czq Total loading time: 0 Render date: 2024-11-25T16:45:11.541Z Has data issue: false hasContentIssue false

Electrical Properties of Sol-Gel Pzt Thin Films for decoupling Capacitor Applications

Published online by Cambridge University Press:  21 February 2011

Robert W. Schwartz
Affiliation:
Sandia National Laboratories, Materials and Process Sciences Center, P.O. Box 5800, Albuquerque, NM 87185-5800 Advanced Materials Laboratory, 1001 University Blvd., SE Suite 100 Albuquerque, NM 87106
D. Dimos
Affiliation:
Sandia National Laboratories, Materials and Process Sciences Center, P.O. Box 5800, Albuquerque, NM 87185-5800
S. J. Lockwood
Affiliation:
Sandia National Laboratories, Materials and Process Sciences Center, P.O. Box 5800, Albuquerque, NM 87185-5800
V. M. Torres
Affiliation:
Sandia National Laboratories, Materials and Process Sciences Center, P.O. Box 5800, Albuquerque, NM 87185-5800
Get access

Abstract

The successful development of PZT thin films for decoupling capacitor devices places stringent requirements on the dielectric and leakage properties of the films. We have characterized these properties for PZT thin films with compositions near the morphotropic phase boundary prepared by a sol-gel process. Capacitors were fabricated from films with thicknesses varying from 0.4 to 1.2 µm. For zero applied bias, the dielectric constants of these films were in the range of 800 to 1200. The room temperature dielectric constant was observed to decrease by ∼ 25% with the application of a 5 V bias. We have also characterized the interrelationships between temperature, applied bias, and dielectric constant. The capacitors exhibited asymmetry in their leakage and breakdown characteristics with bias sign, as well as non-linear I-V behavior. Breakdown fields for undoped PZT 53/47 films were typically in the range of 750 kV/cm.

We have also studied the effects of La and Nb donor doping on the leakage behavior of PZT 50/50 thin films. Doping with 2 to 5 mol % of either La or Nb resulted in a reduction in film leakage current by a factor of 103. Leakage currents of the highly doped materials were approximately 2 × 10−9 A/cm2 under an applied field of ∼ 65 kV/cm at a temperature of 125×C.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Parker, L. H., and Trasch, A. F., IEEE Circuits and Devices Magazine, 1990, 17.Google Scholar
2. Scott, J. F. and Araujo, C. A. Paz de, Science, 246, 1400, (1989).Google Scholar
3. Udayakumar, K. R., Chen, J., Brooks, K. G., Cross, L. E., Flynn, A. M., and Ehrlich, D. J., in Ferroelectric Thin Films II, edited by Kingon, A. I., Myers, E. R. and Tuttle, B., (Mat. Res. Soc. Symp. Proc., 243, Pittsburgh, PA, 1992) pp. 4954.Google Scholar
4. Ye, C., Yamagawa, T., Lin, Y., and Polla, D. L., in Ferroelectric Thin Films 11, edited by Kingon, A.I., Myers, E. R. and Tuttle, B., (Mat. Res. Soc. Symp. Proc., 243, Pittsburgh, PA, 1992) pp. 6166.Google Scholar
5. Land, C.E., J.Am. Ceram. Soc., 71 (11), 905 (1988).Google Scholar
6. See for example, Ferroelectric Thin Films II edited by Kingon, A. I., Myers, E. R. and Tuttle, B., (Mat. Res. Soc. Symp. Proc., 243, Pittsburgh, PA, 1992).Google Scholar
7. Galvagni, J., AVX Technical Report, AVX Corporation, Myrtle Beach, SC.Google Scholar
8. Kersten, O. and Schmidt, G., Ferroelectrics, 67, 191, (1986).Google Scholar
9. Chen, J., Udayakumar, K. R., Brooks, K. G., and Cross, L. E., IEEE ISAF Proc., 1992, 182.Google Scholar
10. Lanagan, M. T., Kim, J. H., Jang, S-J., and Newnham, R. E., J. Am. Ceram. Soc., 71 (4), 311 (1988).Google Scholar
11. Schwartz, R. W., Bunker, B. C., Dimos, D. B., Assink, R. A., Tuttle, B. A., Tallant, D. R., and Weinstock, I. A., Int. Ferroelectrics, 2, 243, (1992).CrossRefGoogle Scholar
12. Assink, R. A. and Schwartz, R. W., Chem. of Mater., 5 (4), 511 (1993).Google Scholar
13. Jaffe, B., Roth, R. S., and Marzullo, S., J. Res. Nat. Bur. Stds., 55, 239, (1955).CrossRefGoogle Scholar
14. Watanabe, H., Mihara, T., and Araujo, C. A. Paz de, Proc. 3rd. Intl. Symp. Int. Ferro., 1991, 139.Google Scholar
15. Klee, M. and Waser, R., in Ferroelectric Thin Films II, edited by Kingon, A. I., Myers, E. R. and Tuttle, B., (Mat. Res. Soc. Symp. Proc., 243, Pittsburgh, PA, 1992) pp. 437442.Google Scholar
16. Schwartz, R. W., Dimos, D., and Tuttle, B. A., to be submitted to J. Am. Ceram. Soc.Google Scholar
17. Chen, X. and Kingon, A. I., presented at the 5th Intl. Symp. Int. Ferro., Colorado Springs, CO, April, 1993.Google Scholar
18. Wu, L., Wu, T-S., Wei, C-C., and Liu, H-C., J. Phys. C: Sol. Stat. Phys., 16, 2823, (1983).Google Scholar
19. Klein, N., “Electrical Breakdown in Solids,” in Advances in Electronics and Electron Physics, (Academic Press, 26, New York, 1969).Google Scholar
20. Moazzami, R., Hu, C., and Shephard, W. H., IEEE IRPS, 1990, 231.Google Scholar