Hostname: page-component-78c5997874-j824f Total loading time: 0 Render date: 2024-11-20T00:15:48.520Z Has data issue: false hasContentIssue false

Electric Field Enhancement of Dark Current Generation in Detectors

Published online by Cambridge University Press:  26 February 2011

James P. Lavine*
Affiliation:
Display and Components, Image Sensor Solutions Eastman Kodak Company, 1999 Lake Avenue Rochester, NY 14650–2008, U.S.A.
Get access

Abstract

The performance of detectors and sensors is degraded by dark current generation, which is due to defects and impurities in the materials. Electric fields enhance the generation from the resulting deep levels. When the electric field is in the mid-105 V/cm range, the present work finds enhancements of the order of 100 or more for iron and gold in silicon. The activation energy of the generation rate as a function of temperature is seen to decrease when the electric field increases. Many detectors have pixels that form a charge packet before the detectors are read out. Since the presence of charge decreases the electric field, the electric field enhancement varies with time. This is modeled for iron in silicon with an illustrative charge versus electric field relation. The resulting activation energy is found to be barely affected.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Hurkx, G.A.M., Klassen, D.B.M., and Knuvers, M.P.G., IEEE Trans. Electron Dev. 39, 331 (1992).Google Scholar
2. Noble, W.P., Voldman, S.H., and Bryant, A., IEEE Trans. Electron Dev. 36, 720 (1989).Google Scholar
3. Lee, H.-D., Lee, S.-G., Lee, S.-H., Lee, Y.-J., and Hwang, J.-M., Jpn. J. Appl. Phys. 37, 1179 (1998).Google Scholar
4. Vincent, G., Chantre, A., and Bois, D., J. Appl. Phys. 50, 5484 (1979).Google Scholar
5. Park, J. E., Shields, J., and Schroder, D. K., Solid-State Electron. 47, 855 (2003).Google Scholar
6. Voldman, S.H., Johnson, J.B., Linton, T.D., and Titcomb, S.L., Tech. Digest of the International Electron Devices Meeting, 349 (1990).Google Scholar
7. Makram-Ebeid, S. and Lannoo, M., Phys. Rev. B 25, 6406 (1982).Google Scholar
8. Schenk, A., Solid-State Electron. 35, 1585 (1992).Google Scholar
9. Ganichev, S.D., Yassievich, I.N., and Prettl, W., J. Phys.: Condens. Matter 14, R1263 (2002).Google Scholar
10. Morante, J.R., Carceller, J.E., Cartujo, P., and Barbolla, J.J., Phys. Status Solidi B 111, 375 (1982).Google Scholar
11. Manual for the computer program DESSIS of Integrated Systems Engineering, version 9.0, (2003) Ch. 5.Google Scholar
12. Lui, O. K. B. and Migliorato, P., Solid-State Electron. 41, 575 (1997).Google Scholar
13. McColgin, W.C., Lavine, J.P., Stancampiano, C.V., and Russell, J.B., Mater. Res. Soc. Symp. Proc. 510, 475 (1998).Google Scholar
14. Graff, K., Metal Impurities in Silicon-Device Fabrication, (Springer-Verlag, Berlin, 2000), 2nd rev. edition, p. 83.Google Scholar
15. Tasch, A.F. and Sah, C.T., Phys. Rev. B 1, 800 (1970).Google Scholar
16. Theunissen, M.J.J. and List, F.J., Solid-State Electron. 28, 417 (1985).Google Scholar
17. Ganichev, S.D., Ziemann, E., Prettl, W., Yassievich, I.N., Istratov, A.A., and Weber, E.R., Phys. Rev. B 61, 10361 (2000).Google Scholar
18. Schenk, A., Irmscher, K., Suisky, D., Enderlein, R., Bechstedt, F., and Klose, H., Proc. 17th Int. Conf. on Physics of Semiconductors, 613 (1984).Google Scholar