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Efficient Interfacial Design - A Multidisciplinary View
Published online by Cambridge University Press: 10 February 2011
Abstract
One of the most important mechanical features in microelectronic packaging is the nterface. Recent developments in modelling interfacial fracture and the easurement of interfacial toughness relevant to microelectronic packaging are discussed.
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- Research Article
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- Copyright © Materials Research Society 1998
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