Hostname: page-component-78c5997874-dh8gc Total loading time: 0 Render date: 2024-11-04T21:13:03.280Z Has data issue: false hasContentIssue false

Effects of Processing Parameters on KrF Excimer Laser Ablation Deposited ZrO2 Films

Published online by Cambridge University Press:  28 February 2011

Gary A. Smith
Affiliation:
Evans Central, Minnetonka, MN 55345
Li-Chyong Chen
Affiliation:
GE Corporate Research and Development, Schenectady, NY 12301
Mei-Chen Chuang
Affiliation:
IBM East Fishkill Facility, Hopewell Junction, NY 12533
Get access

Abstract

Systematic experiments have been carried out to characterize the yttria containing zirconia thin films on sapphire substrates by 248nm KrF excimer laser ablation. The deposition rate as a function of laser fluence and O2 pressure at room temperature was measured with a quartz crystal microbalance. The results show different threshold fluences for deposition in vacuum vs. oxygen. While the deposition rate increases with increasing fluence at a given oxygen pressure, the rate eventually saturates at a higher laser fluence. At a given fluence, the oxygen pressure dependence of the deposition rate shows a radical reduction when the O2 pressure increases from 10 mTorr to 1 Torr. Rutherford backscattering spectrometry (RBS) and x-ray photoelectron spectroscopy were used to obtain stoichiometric information. A very strong pressure dependence of the O/Zr ratio was observed. While the trend of increasing O/Zr and Zr/Y ratio with increasing O2 pressure is apparent, the correlations between O/Zr as well as Zr/Y ratio and other processing conditions are less obvious. RBS results indicate an increasing roughness at the interface between the ZrO2 film and the sapphire substrate as the oxygen pressure exceeds 50 mTorr. The structural information obtained from x-ray diffraction patterns indicates broadening of peak width with increasing laser fluence as well as decreasing substrate temperature. For the film deposited at a lower substrate temperature, a strong (002) texture was observed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Cheung, J. T. and Sankur, H., CRC Critical Reviews in Solid State and Materials Sciences, 15 (1), 63 (1988).CrossRefGoogle Scholar
2. Sankur, H., DeNatale, J., Gunning, W., and Nelson, J. G., J. Vac. Sci. Technol. A5(5), 2869 (1987).CrossRefGoogle Scholar
3. James, A. S. and Matthews, A., Surface and Coatings Technology, 41, 305 (1990).CrossRefGoogle Scholar
4. For example, Chuang, M. C. and Tarn, A. C., J. Appl. Phys., 65, 2591 (1989).Google Scholar
5. Dyer, P. E., Issa, A., and Key, P. H., Appl. Phys. Lett. 57, 186 (1990).CrossRefGoogle Scholar
6. Mashburn, D. N. and Geohegan, D. B., Processing of Films for High-Tc Microelectronics, SPIE, 1187, 172 (1989).Google Scholar
7. Geohegan, D. B., Surface Chemistry and Beam-Solid Interactions, MRS Proceedings of the 1990 Fall Meeting, vol. 201 (1990).Google Scholar
8. Koren, G., Appl. Phys. Lett. 51, 569 (1987).CrossRefGoogle Scholar
9. Movchan, B. A. and Demchishin, A. V., Phys. Met. Metallogr. (USSR), 28, 83 (1969).Google Scholar
10. Thornton, J. A., Ann. Rev. Mater. Sci., 7, 239 (1977).CrossRefGoogle Scholar