Hostname: page-component-586b7cd67f-rdxmf Total loading time: 0 Render date: 2024-11-26T20:39:58.887Z Has data issue: false hasContentIssue false

Effects of Excess Pb on Crystallization and Electrical Properties of Ferroelectric PZT Films Deposited by Reactive RF Magnetron Sputtering

Published online by Cambridge University Press:  15 February 2011

S.D. Bernstein
Affiliation:
Raytheon Research Division, Lexington, MA.
T.Y. Wong
Affiliation:
Raytheon Research Division, Lexington, MA.
S.R. Collins
Affiliation:
Raytheon Research Division, Lexington, MA.
Yanina Kisler
Affiliation:
Raytheon Research Division, Lexington, MA.
R.W. Tustison
Affiliation:
Raytheon Research Division, Lexington, MA.
Get access

Abstract

Films were deposited onto unheated, Ti/Pt coated Si substrates by reactive sputtering in an argon-oxygen atmosphere from a sintered PZT target, and subsequently crystallized at temperatures between 550 and 650 °C. Pt/PZT/Pt capacitors were formed by ion beam sputtering of top electrodes through a shadow mask. Electrical properties were found to depend on gas pressure during deposition. This effect is interpreted in terms of variations in film stoichiometry (particularly Pb content). Films with large excesses of Pb were found to exhibit high leakage currents and poor ferroelectric behavior, whereas films with lower excesses of Pb had low leakage currents, and good ferroelectric properties. Films with the largest Pb excess had a random orientation, while the film with the lowest Pb excess had a preferred (111) orientation. With 550 °C crystallization temperatures the films consist of a mixture of ferroelectric perovskite phase and either PZT pyrochlore or PbO. At higher crystallization temperatures no pyrochlore is detected.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Scott, J.F. and Paz De Araujo, C.A., Science 246, 1400 (1989).Google Scholar
2. Parker, L.H., and Tasch, A.F., IEEE Circuits and Devices Magazine January, 17 (1990).Google Scholar
3. Sheppard, L.M., Ceramic Bulletin 71, 85 (1992).Google Scholar
4. Adachi, H., and Wasa, K. in Ferroelectric Thin Films, edited by Myers, E.R., and Kingon, A.I. (Mater. Res. Soc. Proc. 200, Pittsburgh, PA, 1990) pp. 103114.Google Scholar
5. Krupanidhi, S.B., Maffei, N., Sayer, M., and El-Assal, K., J. Appl. Phys. 54 6001 (1983).Google Scholar
6. Sreenivas, K., Sayer, M., and Garrett, P., Thin Solid Films 172, 251 (1989).Google Scholar
7. Tuttle, B.A., Schwartz, R.W., Doughty, D.H., and Voigt, J.A. in Ferroelectric Thin Films. edited by Myers, E.R., and Kingon, A.I. (Mater. Res. Soc. Proc. 200, Pittsburgh, PA, 1990).Google Scholar
8. Bernstein, S.D., Kisler, Yanina, Wahl, J.M., Bernacki, S.E., and Collins, S.R. in Ferroelectric Thin Films II. edited by Kingon, A.I., Myers, E.R., and Tuttle, B. (Mater. Res. soc. Proc. 243, Pittsburgh, PA, 1990) pp. 373378.Google Scholar
9. Ling, H.C., Jackson, A.M., Yan, M.F., and Rhodes, W.W., J. Mater. Res. 5, 629 (1990).Google Scholar
10. Fox, G.R., and Krupanidhi, S.B., J. Mater. Res. 8, 2203 (1993).Google Scholar
11. US Inc., Campbell, CA.Google Scholar
12. Hanak, J.J., and Pellicane, J.P., J. Vac. Sci. Technol. 13, 406 (1976).Google Scholar
13. Standardized Ferroelectric Tester, Radiant Technologies, Albuquerque, NM.Google Scholar
14. Rossnagel, S.M., and Cuomo, J.J., AIP Conf. Proc. 165, 106 (1988).Google Scholar
15. Rossnagel, S.M., Yang, I., and Cuomo, J.J., Thin Solid Films 199, 59 (1991).Google Scholar
16. Glang, R., in Handbook of Thin Film Technology, Edited by Maissel, L.I. and Glang, R. (McGraw-Hill, New York, 1970), pp. 121.Google Scholar
17. Vasant Kumar, C.V.R., Pascual, R., and Sayer, M., J. Appl. Phys. 71, 864 (1992).Google Scholar
18. Bemacki, S.E. (private communication).Google Scholar
19. Krupanidhi, S.B., Hu, H., and Kumar, V., J. Appl. Phys. 71, 376 (1992).Google Scholar
20. Roy, R.A., and Etzold, K.F., J. Mater. Res. 7, 1455 (1992).Google Scholar