Hostname: page-component-cd9895bd7-jn8rn Total loading time: 0 Render date: 2024-12-27T02:37:37.997Z Has data issue: false hasContentIssue false
  • English
  • Français

The Effects of Environment and Fatigue on the Adhesion and Subcritical Debonding of Dielectric Polymers

Published online by Cambridge University Press:  10 February 2011

J. M. Snodgrass ,
D. Pantelidis ,
J. C. Bravman  and
R. H. Dauskardt
J. M. Snodgrass
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford, CA 94305
D. Pantelidis
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford, CA 94305
J. C. Bravman
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford, CA 94305
R. H. Dauskardt
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford, CA 94305
Get access

Abstract

The adhesion of thin film polymers will be critical in the integration of low-κ materials into microelectronic processing. This study describes the adhesion of two promising low-κ polymers (polyimide and benzocyclobutene) to a silicon dioxide surface. Critical adhesion values were measured using interface fracture mechanics samples in a double cantilever beam geometry. The effect of subcritical (time-dependent) delamination was also evaluated for these systems. Subcritical debonding data are important in understanding the effect of environment and temperature on interface reliability. To that end, experiments were conducted over a range of humidities to elucidate the effect of moisture on interface delamination. The important effect of the acceleration of debond growth rates due to cyclic loading is also described. In addition, XPS studies are presented to characterize the debond path in these layered systems.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 565: Symposium O – Low-Dielectric Constant Materials V , 1999 , 123
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Ritter, J.E., Lardner, T.J., Grayeski, W., Prakash, G.C. and Lawrence, J.. “Fatigue Crack Propagation at Polymer Adhesive Interfaces.” J. Adhesion 63 (1997) 265.Google Scholar
2. Ohashi, K.L., Kook, S.-Y., Kirtikar, A., and Dauskardt, R. H., “Adhesion and Progressive Delamination of Polymer/Metal Interfaces,” High Cycle Fatigue of Structural Materials, (Proc. of TMS, Fall 1997) pp. 479–498.Google Scholar
3. Hertzberg, R. W., Deformation and Fracture Mechanics of Engineering Materials, 3rd ed. (J. Wiley, New York, 1989) pp. 524–526.Google Scholar
4. Wiederhorn, S. M., “Influence of Water Vapor on Crack Propagation in Soda-Lime Glass,” J. Am. Cer. Soc. 50 (1967) 407.10.1111/j.1151-2916.1967.tb15145.xGoogle Scholar
5. Tonyali, K., Brown, H.R., “On the Applicability of Linear Elastic Fracture Mechanics to Environmental Stress Cracking of Low Density Polyethylene,” J. Mater. Sci. 21 (1986) 3116.10.1007/BF00553345Google Scholar
6. Shaffer, E. II, Townsend, P. H. and Im, J.. “Measuring and Predicting the Reliability of Low-K Polymeric Dielectric Materials,” Advanced Metallization And Interconnect Systems for ULSI, Havermann, O, ed., (Mater. Res. Soc. Proc., Fall 1996) pp. 429–435.Google Scholar
7. Kanninen, M. F., “An Augmented Double Cantilever Beam Model for Studying Crack Propagation and Arrest,” Int. J. Fract. 9 (1973) 83.Google Scholar
8. Evans, A.G., “A Simple Method for Evaluating Slow Crack Growth in Brittle Materials,” Int. J. Fract. 9 (1973) 267.10.1007/BF00049195Google Scholar
9. Kinloch, A. J., Adhesion and Adhesives:Science and Technology, (Chapman & Hall, London, 1987) p. 345.10.1007/978-94-015-7764-9Google Scholar