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Effective Channel Mobility in Epitaxial and Implanted 4H-SiC Lateral MOSFETs

Published online by Cambridge University Press:  01 February 2011

Sarah Kay Haney
Affiliation:
[email protected], Cree, Inc, Power R&D, 4600 Silicon Drive, Durham, NC 27703, USA, Durham, NC, 27703, United States, 919 287 7555, 919 313 5696
Sei-Hyung Ryu
Affiliation:
[email protected], Cree, Inc, Power R&D, 4600 Silicon Drive, Durham, NC, 27703, United States
Sarit Dhar
Affiliation:
[email protected], Cree, Inc, Power R&D, 4600 Silicon Drive, Durham, NC, 27703, United States
Anant Agarwal
Affiliation:
[email protected], Cree, Inc, Power R&D, 4600 Silicon Drive, Durham, NC, 27703, United States
Mark Johnson
Affiliation:
[email protected], North Carolina State University, Department of Materials Science, Raleigh, NC, 27695, United States
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Abstract

In this paper, we investigate the effective inversion layer mobility of lateral 4H-SiC MOSFETs. Initially, lateral n-channel MOSFETs were fabricated to determine the effect of p-type epi-regrowth on a highly doped p-well surface. The negative effects of the high p-well doping are still seen with 1500 Å p-type regrowth, while growing 0.5 um or more appears to be sufficient to grow out of the damaged area. A second experiment was performed to examine the effects of doping during epitaxial regrowth versus using ion implantation after regrowth. Comparable mobilities and threshold voltages were observed for equivalent epitaxial and implanted doping concentrations.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

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References

REFERENCES

[1] Jamet, P., Dimitrijev, S., Appl. Phys. Lett., vol. 79, no. 3, pp. 323325, July 2001.Google Scholar
[2] Chung, G. Y., Tin, C. C., Williams, J. R., McDonald, K., Chanana, R. K., Weller, R. A., Pantelides, S. T., Feldman, L. C., Holland, O. W., Das, M. K. and Palmour, J. W., IEEE Electron Dev. Lett., vol. 22, no. 4, pp. 176178, April 2001.Google Scholar
[3] Agarwal, A., Haney, S., J. Electronic Materials, online, DOI 10.1007/s11664-007-0321-3, Nov 2007.Google Scholar
[4] Haney, S., Agarwal, A., J. Electronic Materials, online, DOI 10.1007/s11664-007-0310-6, Nov 2007.Google Scholar
[5] Schorner, R., Friedrichs, P., Peters, D., IEEE Trans on Electron Devices., vol 46, no. 3, pp. 533541, March 1999.Google Scholar