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The Effect of Temperature on Defect Production in Copper Doped with Beryllium

Published online by Cambridge University Press:  25 February 2011

A. C. Baily
Affiliation:
Department of Materials Science & Engineering, Northwestern University, Evanston, IL 60201
Wayne E. King
Affiliation:
Argonne National Laboratory, Argonne, IL 60439
K. L. Mrkle
Affiliation:
Argonne National Laboratory, Argonne, IL 60439
M. Meshii
Affiliation:
Department of Materials Science & Engineering, Northwestern University, Evanston, IL 60201
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Abstract

The effect of temperature on radiation-induced defect production was investigated in Cu single crystal films doped with ∼ 100 ppm Be. Frenkel pair production was determined at 55K and 190K as a function of electron energy and incident beam direction using in situ electrical resistivity measurements in the high voltage electron microscope. The crystallographic anisotropy of defect production was found to be considerably greater for irradiations at 55K than for irradiations below 10K. This difference is related largely to an observed anisotropy in the stage I defect recovery. It was found in isochronal annealing experiments after irradiation nearthreshold that the resistivity remaining after stage I was nearly twice as large for recoils along <110> as compared to <100>.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

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