Hostname: page-component-586b7cd67f-gb8f7 Total loading time: 0 Render date: 2024-11-25T15:32:59.842Z Has data issue: false hasContentIssue false

The Effect of Reaction Driving Force on Copper Nanoparticle Preparation by Liquid Phase Reduction Method

Published online by Cambridge University Press:  31 January 2011

Qingming Liu
Affiliation:
[email protected], Nagoya University, Department of Materials Science, Nagoya, Japan
Debi Zhou
Affiliation:
[email protected], Central South University, School of Chemistry and Chemical Engineering, Changsha, China
Kazuaki Nishio
Affiliation:
[email protected], Nagoya University, Department of Materials Science, Nagoya, Japan
Salah Salman
Affiliation:
[email protected], Nagoya University, Department of Materials Science, Nagoya, Japan
Ryoichi Ichino
Affiliation:
[email protected], Nagoya University, Department of Materials Science, Nagoya, Japan
Masazumi Okido
Affiliation:
[email protected], Nagoya University, Department of Materials Science, Nagoya, Japan
Get access

Abstract

Copper nanoparticle was prepared by liquid phase reduction technique. Cu2+ was reduced to copper particle by adopting different types of reductants. Ascorbic acid (C6H8O6), phosphinic acid (H3PO2), titanium sulfate (Ti2(SO4)3) and sodium borohydride (NaBH4) were chosen as reductant, respectively. The effect of reaction driving force upon the average size of copper particle was investigated in the paper. It can be concluded that there is a firm relationship between the reaction driving force and the average size of copper particle. The average size of copper particle decreases with the increasing of reaction driving force.

Type
Research Article
Copyright
Copyright © Materials Research Society 2010

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Songping, Wu, Shuyuan, Meng, Materials Letters. 60 (20), 2438 (2006).Google Scholar
[2] Huang, Chien-Yu, Sheen, Shyang Roeng, Materials Letters. 30 (5-6), 357 (1997).Google Scholar
[3] Okamoto, Takeshi, Ichino, Ryoichi, Okido, Masazumi, Liu, Zhihong, Resource and Materials. 121, 255 (2005).Google Scholar
[4] Wu, Szu-Han and Chen, Dong-Hwang, Journal of Colloid and Interface Science. 273 (1), 165 (2004).Google Scholar
[5] Goia, Dan V. and Matijevic, Egon, New J. Chem. 22, 1203 (1998).Google Scholar
[6] Lu, Jianming, Dreisinger, D.B., Cooper, W.C., Hydrometallurgy. 45, 305 (1997).Google Scholar
[7] Marcel Pourbaix: Atlas of Electrochemical Equilibria in Aqueous Solutions. (Pergamon Press, Oxford, 1966), p. 384386.Google Scholar