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Effect of Pad Surface Texture and Slurry Abrasive Concentration on Tribological and Kinetic Attributes of ILD CMP

Published online by Cambridge University Press:  01 February 2011

Ara Philipossian  and
Scott Olsen
Ara Philipossian
Affiliation:
Department of Chemical and Environmental EngineeringThe University of Arizona, Tucson, AZ 85721 USA
Scott Olsen
Affiliation:
Department of Chemical and Environmental EngineeringThe University of Arizona, Tucson, AZ 85721 USA
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Abstract

Real-time coefficient of friction (COF) analysis is used to determine the extent of normal and shear forces during CMP and identify the lubrication regimes associated with the process. Pads with different surface textures and slurries with varying abrasive concentrations are used to polish ILD films over a wide range of operating parameters. Results show that by varying abrasive concentration and pad surface texture, one can cause the process tribology to change from ‘boundary lubrication’ to ‘partial lubrication’, to ‘hydrodynamic lubrication’. A two-phase model relating average coefficient of friction and Preston's constant is presented. At abrasive concentrations up to 9 percent, material removal is proportional to the extent of contact between the abrasives and the wafer. At abrasive concentrations between 9 to 25 percent, removal rate is directly influenced by average COF. A new parameter termed the ‘tribological mechanism indicator’ is defined and extracted from the data, which coupled with the information on COF and ILD removal rate, results in a series of ‘universal’ correlations. A qualitative model based on pad storage modulus is used to explain the trends.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 767: Symposium F – Chemical-Mechanical Planarization , 2003 , F2.8
Copyright
Copyright © Materials Research Society 2003

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