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Effect of La on the Growth of Cu6Sn5 Intermetallic Compound for Improved Sn-Pb Solder Joints

Published online by Cambridge University Press:  17 March 2011

Xin Ma ,
Hongyuan Fang ,
Yiyu Qian  and
Fusahito Yoshida
Xin Ma
Affiliation:
National Key Laboratory of Reliability Physics of Electronic Product, P.O.Box 1501-05, Guangzhou, 510610, P.R.CHINA
Hongyuan Fang
Affiliation:
National Key Laboratory of Welding, Harbin Institute of Technology, Harbin, 150001, P.R.CHINA
Yiyu Qian
Affiliation:
National Key Laboratory of Welding, Harbin Institute of Technology, Harbin, 150001, P.R.CHINA
Fusahito Yoshida
Affiliation:
Department of Mechanical Engineering, Hiroshima University, Higashi-Hiroshima, 739-8527, JAPAN
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Abstract

Small amount of rare earth element La were added into the traditional Sn60-Pb40 solder alloy in order to improve the reliability of solder joints. The results of aging tests of solder joints showed that, the growth of interface Cu6Sn5 intermetallic compound was depressed by La addition. Furthermore, the thermal fatigue life of solder joints was improved by 3 times. Thermodynamic analysis indicated that La had higher affinity with Sn in the Sn-Pb-La system, and then the driving force for Cu6Sn5formation was reduced since the activity of Sn was lowered.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 657: Symposia EE – Materials Science of Microelectromechanical Systems (MEMS) Devices III , 2000 , EE5.18
Copyright
Copyright © Materials Research Society 2001

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References

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