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The Effect of Intrinsic Passivation Stress on Stress in Encapsulated Interconnect Lines

Published online by Cambridge University Press:  21 February 2011

Anne Sauter Mack  and
Paul Flinn
Anne Sauter Mack
Affiliation:
Intel Corporation, 3065 Bowers Avenue, Santa Clara, CA 95052
Paul Flinn
Affiliation:
Intel Corporation, 3065 Bowers Avenue, Santa Clara, CA 95052
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Abstract

The stress in an encapsulated metal line has been calculated using the finite element technique for two passivation stress conditions. It is found that the stress-state in the passivation has a negligible effect on the stress in the metal line. The dominant factors affecting metal line stress are the passivation temperature, the thermal expansion coefficient difference between the metal line and the substrate, and the passivation modulus.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 356: Symposium B2 – Thin Films: Stresses and Mechanical Properties V , 1994 , 465
Copyright
Copyright © Materials Research Society 1995

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References

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