Hostname: page-component-7bb8b95d7b-qxsvm Total loading time: 0 Render date: 2024-10-04T06:17:19.948Z Has data issue: false hasContentIssue false
  • English
  • Français

Effect of High Temperature Stress on Titanium-Tungsten Gold thin Films on Alumina

Published online by Cambridge University Press:  22 February 2011

Wei H. Koh  and
W. Louie
Wei H. Koh
Affiliation:
Grumman Sensor Systems, 2852 Kelvin, Irvine, CA 92714
W. Louie
Affiliation:
Grumman Sensor Systems, 2852 Kelvin, Irvine, CA 92714
Get access

Abstract

The adhesion of a sputtered titanium-tungsten gold (Ti-W/Au) thin film on alumina substrates is found to be weakened after being stressed at temperatures above 575°C, due to depletion of the Ti-W base metal. Thin films deposited on substrates having a fine grain structure and as fired surfaces, however, maintained their adherence at temperatures up to 650°C.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 623
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Ghate, P.B., Tuller, J.C., and McGuire, G.E., Thin Solid Films, 52, 117(1978).Google Scholar
2. Nowicki, R.S., Harris, J.M., Nicolet, M.-A., and Mitchell, I.V., Thin Solid Films, 53, 195(1978).Google Scholar
3. Wolters, R.A.M. and Nellissen, A.J.M., Solid State Technology, 29(2). 131(1986).Google Scholar
4. LaCombe, D.J., Dening, D.C., and Christou, A., IEEE/PROC. IRPS 1982. 81.Google Scholar
5. Khaund, A. K. and Cutts, C. L., The International Journal for Hybrid Microelectronics, 10(1). 36(1987).Google Scholar