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Effect of High Temperature Stress on Titanium-Tungsten Gold thin Films on Alumina

Published online by Cambridge University Press:  22 February 2011

Wei H. Koh  and
W. Louie
Wei H. Koh
Affiliation:
Grumman Sensor Systems, 2852 Kelvin, Irvine, CA 92714
W. Louie
Affiliation:
Grumman Sensor Systems, 2852 Kelvin, Irvine, CA 92714
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Abstract

The adhesion of a sputtered titanium-tungsten gold (Ti-W/Au) thin film on alumina substrates is found to be weakened after being stressed at temperatures above 575°C, due to depletion of the Ti-W base metal. Thin films deposited on substrates having a fine grain structure and as fired surfaces, however, maintained their adherence at temperatures up to 650°C.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 623
Copyright
Copyright © Materials Research Society 1992

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References

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