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Effect of Heat Treatment on Adhesion in the Cr/Al2O3 System

Published online by Cambridge University Press:  15 February 2011

Sriram Viswanathan  and
David L. Kohlstedt
Sriram Viswanathan
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455.
David L. Kohlstedt
Affiliation:
Department of Geology and Geophysics, University of Minnesota, Minneapolis, MN 55455.
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Abstract

Continuous microscratch experiments have been carried out to investigate the effect of various heat treatments on adhesion in the Cr/Al2O3 system. After samples were prepared by vapor depositing 0.32 µm thick Cr films on (1102) surfaces of single crystal sapphire substrates, they were annealed at different temperatures at controlled oxygen partial pressures. In the subsequent continuous microscratch tests, a conical diamond indenter with a 1 µm tip radius was driven simultaneously into and across the sample until a load drop occurred. Optical and scanning electron microscopy observations demonstrate that a portion of the Cr film delaminated from the Al2O3 substrate at that point. The interfacial strain energy release rate was calculated from the load at failure combined with the size and geometry of the delaminated region. The work of adhesion was found to decrease dramatically on annealing in an H2-Ar mixture at 250°C.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 659
Copyright
Copyright © Materials Research Society 1993

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References

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