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The Effect Of Chamber Components On Wafer Temperature Response In An Rtp System

Published online by Cambridge University Press:  10 February 2011

N. Acharya  and
P. J. Timans
N. Acharya
Affiliation:
AG Associates, 4425 Fortran Drive, San Jose, CA 95134-2300
P. J. Timans
Affiliation:
AG Associates, 4425 Fortran Drive, San Jose, CA 95134-2300
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Abstract

In recent years, simulation techniques have emerged as useful tools for the design of semiconductor equipment. However, the need for rapid assessment of potential designs stretches the capability of even the most advanced tools currently available to the limit. In this paper, a simplified model of a rapid thermal processing (RTP) system that significantly reduces the execution time is presented. The model is based on a coupling of semi-analytical expressions for radiation fluxes with a one-dimensional finite element heat transfer model for wafer and slip-free ring temperatures. Results showing the effects of plate reflectivity and slip-free ring emissivity on wafer temperature are presented. It is shown that the simplified model yields results that are in agreement with detailed two-dimensional simulations of the same geometry.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 525: Symposium W – Rapid Thermal & Integrated Processing VII , 1998 , 21
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

1. Jensen, K. F., Merchant, T. P., Cole, J. V., Hebb, J. P., Knutson, K. L. and Mihopoulos, T. G., in Proc. NATO Advanced Study Institute, edited by F., Roozeboom, (Advances in Rapid Thermal and Integrated Processing, 1995), Kluwer Academic Publishing, The Netherlands.Google Scholar
2. Merchant, T. P., Egan, E. W. and Lorigan, R. P., in Rapid Thermal Processing '95, edited by Fair, R. B. and Lojek, B. (RTP'95, Amsterdam, Netherlands, 1995) pp. 376–380.Google Scholar
3. Knutson, K. L. and Campbell, S. M., in Rapid Thermal Processing '96, edited by Fair, R. B., Green, M. L., Lojek, B. and Thakur, R. P. S. (RTP'96, Boise, 1996) pp. 332–341.Google Scholar
4. Li, J. G., Champetier, R. J. and Timans, P. J., in Rapid Thermal Processing '97, edited by Fair, R. B., Green, M. L., Lojek, B. and Thakur, R. P. S., (RTP'97, New Orleans, 1997) pp. 305–310.Google Scholar
5. Siegel, R. and Howell, J. R., Thermal Radiation Heat Transfer, Hemisphere Publishing, New York, 1981 Google Scholar
6. Knutson, K. L., Internal research report, A. G. Associates, 1996.Google Scholar